Hitachi Chemical Company, Ltd.

Yoshinori Endou

Mitsuo Katayose

Shinsuke Hagiwara

Masaki Yoshii

Fumio Furusawa

Seiichi Akagi

Ryoichi Ikezawa

Naoki Nara

Takaki Kashihara

Hideyuki Chaki

Yoshihiro Mizukami

Takatoshi Ikeuchi

Ryouichi Ikezawa

Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame retardance, formability, reflow resistance, moisture resistance, high-temperature shelf characteristics and the like, and is suitably used for encapsulation of a VLSI. Also disclosed is an electronic component comprising an element encapsulated with such a material. (I) (In the general formula (I), Rs may be the same or different and respectively represent one selected from substituted or unsubstituted hydrocarbon groups having 1-12 carbon atoms and substituted or unsubstituted alkoxy groups having 1-12 carbon atoms; n represents an integer of 0-4; Rs may be the same or different and respectively represent one selected from substituted or unsubstituted hydrocarbon groups having 1-12 carbon atoms and substituted or unsubstituted alkoxy groups having 1-12 carbon atoms; and m represents an integer of 0-6.) 

Sealant epoxy-resin molding material, and electronic component device

An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 &#x3bc;m or less and a specific surface area of 3.0 m/g or more.

Epoxy resin molding material for sealing use and semiconductor device

Growing community of inventors

Chikusei, Japan

Yoshinori Endou