Yamaichi Electric Mfg. Co., Ltd.

Yoshinori Egawa

Ryuichi Nakamura

Hidetaka Nakano

An IC socket including a socket board having a plurality of contacts on which an IC is to be placed, an IC pressing cover open- and closeably pivotally connected to the socket board, and an IC loading table with the IC loaded thereon, the table being disposed on the socket board and adapted to facilitate a proper contact between the IC and the contacts, the IC socket further including a positioning projection of a generally V-shape formed on the side of the IC pressing cover and a positioning valley of a generally V-shape formed on the side of the IC loading table, the projection and valley being disposed in such a manner as to be corresponded to each other, the generally V-shaped positioning projection being held into the generally V-shaped valley when the IC pressing cover is closed, so that a relative position of the IC pressing cover can be maintained with respect to the IC loading table and IC.

IC socket

There is disclosed a socket for an IC package in which many IC lead wires project from the IC package and are arranged in vertical rows Y and lateral rows X, and the respective IC lead wires are arranged at equal pitches on the vertical rows Y and the lateral rows X. The socket, has a base plate having contacts and an IC mounting cover for moving the IC package between a contact engaging position and a release position. The cover is cross movably overlapped on the base plate. The IC mounting cover has many IC insertion holes arranged in a lattice shape. The respective rows X and Y of the IC lead wire insertion hole groups are inclined at the same angles with respect to respective sides of the cover. The diagonal lines W of the lattice shaped arrangement are arranged in parallel with two sets of opposite sides of the cover respectively. The repective rows X and Y of the contact groups are inclined at same angles with respect to the respective sides of the socket base plate. The diagonal lines W of the lattice shaped arrangement are arrranged in parallel with two sets of opposite sides of the socket base plate. The contacting pieces of the contacts are arranged as such that contacting points of the contacts and IC lead wires are facing in the direction of the diagonal lines W of the respective lattice shaped arrangements.

Lattice shaped arrangement type socket for IC package

A semiconductor device carrier includes a carrier substrate having an open section in which a semiconductor device is accommodated, and a retaining member slidably coupled to the carrier substrate which linearly recriprocates on a surface of the carrier substrate having the open section and which is provided with a retaining element adapted to retain the semiconductor device accommodated within the open section of the carrier substrate when the retaining member has moved in one direction and to release the retention of the semiconductor device when the retaining member has moved in the other direction.

Semiconductor device carrier

A socket for an electronic device having leads projecting laterally therefrom comprises a socket substrate having grooves formed on one surface thereof for accommodating the leads therein and also having contacts which are plate members punched out of a strap of plate and bent in a substantially L-shape with a fold in the widthwise direction and each composed of a first plate strip and a second plate strip with the fold as a boundary, the first plate strip having one surface laid along and supported on the bottom of the groove to thereby serve as a rigid contact, the second plate strip being implanted from the bottom of the groove in the socket substrate to project downwardly from the lower surface of the socket substrate and serve as a male terminal, and a cover being superposed on and fixed with fastening means to the socket substrate and having resilient pressure strips each resiliently clamping, in cooperation with the other surface of the first plate strip, the lead of the electronic device accommodated in the groove of the socket substrate.

Socket for electronic device

A connector for an IC package has a connector body, an IC package accommodation compartment formed in the connector body, a peripheral wall defining the compartment, and a plurality of partition walls projecting from the inside surface of the peripheral wall toward the compartment at regular intervals and extending from the upper surface of the peripheral wall toward the bottom of the compartment to define contact accommodation grooves. A plurality of contacts corresponding in number to IC leads of the IC package are accommodated within the grooves and are isolated from one another by the partition walls. Each contact is formed of a resilient contact piece having a planted part implanted in the connector body, a male terminal projecting from the bottom of the connector body and a leading part rising from the printed part and slanting toward the compartment. The leading part has an engaging part bent toward the compartment and is resiliently displaced in a direction away from the compartment by a bent part of the IC lead when the IC package is inserted into the compartment. When the IC package has been set in position relative to the connector body, the leading part is returned toward its original position while still having a resilient force biasing itself to its original position. The engaging part remains in resilient contact with the IC lead at a shoulder part of the IC lead.

IC package connector

An IC socket with a mechanism for removing an IC package mounted therein and which has terminals to be brought into contact with terminals of the IC socket, the IC socket has a socket body with terminals around a package receiving recess to receive terminals of the IC package, a cover pivotally attached to the socket body and pivotable to a closed position, a lock for locking the cover, and a suction cup attached to the under side of the cover for snugly retaining the IC package in said recess in said socket body when the cover is locked and holding said IC package thereon by suction when the cover is opened relative to the IC socket body for removing the IC package from the socket body. A mounting stem on the suction cup extends through a bore in the cover and a flange on the end of the mounting stem seats in a flange receiving recess. A pressing portion projecting inwardly from the cover presses the terminals of the IC package firmly into contact with the terminals of the socket body when the cover is closed. The suction end of the suction cup projects slightly outwardly from the free end of the pressing portion, whereby the IC package held on the suction cup is spaced slightly from the pressing portion when the cover is opened.

Connector with component removal means

An IC package carrier comprises a carrier body having a receiving section defined therein for accommodating an IC package therein, a pair of latch levers disposed on the opposite sides of the receiving section and supported by the walls of the carrier body defining the receiving section as being rotatable about pivots between their respective locking positions and their respective unlocking positions, and engaging means provided on both the carrier body and each of the pair of latch levers for maintaining the IC package in the pinched state when the pair of latch levers are in their respective locking positions.

Growing community of inventors

Tokyo, Japan

Yoshinori Egawa