Growing community of inventors

Hofu, Japan

Yoshinobu Kodani

Average Co-Inventor Count = 6.67

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 70

Yoshinobu KodaniSatoshi Ibaraki (5 patents)Yoshinobu KodaniNaoto Yoshinaga (5 patents)Yoshinobu KodaniTakaomi Ikeda (5 patents)Yoshinobu KodaniNiro Shiomi (4 patents)Yoshinobu KodaniYoshiharu Wakayama (4 patents)Yoshinobu KodaniYoshimi Murage (4 patents)Yoshinobu KodaniJun Shimomura (3 patents)Yoshinobu KodaniJun Shimormura (1 patent)Yoshinobu KodaniYoshinobu Kodani (5 patents)Satoshi IbarakiSatoshi Ibaraki (9 patents)Naoto YoshinagaNaoto Yoshinaga (6 patents)Takaomi IkedaTakaomi Ikeda (5 patents)Niro ShiomiNiro Shiomi (7 patents)Yoshiharu WakayamaYoshiharu Wakayama (5 patents)Yoshimi MurageYoshimi Murage (5 patents)Jun ShimomuraJun Shimomura (4 patents)Jun ShimormuraJun Shimormura (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Air Water Inc. (5 from 43 patents)


5 patents:

1. 8658120 - Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor

2. 8409756 - Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor

3. 8411415 - Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor

4. 8293860 - Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor

5. 8158095 - Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor

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1/6/2026
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