Rohm Co., Ltd.

Yoshinobu Kishimoto

Takaya Nagahata

Hisayoshi Fujimoto

Toshio Amano

Shigeo Ota

Tokihiko Kishimoto

Fumiaki Tagashira

Toshiyuki Shirasaki

Koji Nishi

Yasuhiro Yoshikawa

Yoshinori Matsumoto

Teruhisa Sako

Hiroshi Fukumoto

Koichi Wada

Masayoshi Yamaguchi

Shigeyoshi Ono

Akihiro Tanaka

Yoshihiro Ishizaki

Hisato Matsumoto

A clip connector (A) includes an insulating housing ( ) and a plurality of terminals ( ) projecting from the housing ( ). The housing ( ) includes an outer surface ( ) for engaging a support member such as a printed board. The outer surface ( ) is irregular, including a plurality of projecting portions ( ) and a plurality of retreating portions ( ). Each of the terminals ( ) includes a straight portion ( ) and a bent portion ( ). Each of the straight portion ( ) is formed with a through-hole ( ) through which a resin for bonding the support member and the outer surface ( ) is applied.

Clip connector, method of attaching clip connector, and assembly of clip connector and support member

A drive IC for a printing head is rectangular with first and second longer sides, and first and second shorter sides. The drive IC has a multiplicity of drive output pads arranged adjacent to and along the first longer side. The drive IC also has control signal pads which include at least a data-in pad, a data-out pad, a strobe pad, a logic power supply pad, and a clock pad. The control signal pads are arranged adjacent to the respective shorter sides.

Drive IC for a printing head

A pair of holes are formed with a predetermined space therebetween on a long and narrow base plate. An adhesive is applied to the surface of the base plate. Head substrates each having a row of thermal resistors on the surface thereof are placed on the adhesive on the base plate such that the joint of the head substrates is positioned between the pair of holes of the base plate. The adhesive is hardened in the state in which the head substrates are pushed upward by a thruster(s) means inserted into a pair of holes while the base plate is supported from below and the head substrates is pressed from above. The base plate is bonded to a radiating plate by an adhesive only at the central portion. Thus, there is no difference in level at the joint of the head substrates, and even when the radiating plate expands due to heat, the base plate is not deformed.

Thermal head having substantially flush adjacent head substrates

A divisional-type thermal printhead comprises an elongate support member, and a crow of unit head substrates each fixed on the support member and carrying a resistor line extending longitudinally of the support member. A pair of V-shaped boundary spaces is formed between each two adjacent unit head substrates to extend transversely from the resistor line in opposite directions. A resin spacer is formed in each of the boundary spaces to prevent warping or bending of the printhead.

Divisional-type thermal printhead

A printing head comprises an elongate head substrate provided with a line of printing dots along a first longitudinal edge of the substrate, and an array of drive IC's provided on the head substrate along a second longitudinal edge of the substrate. The substrate is further provided with a plurality of connection terminals adjacent to the second longitudinal edge. The drive IC array is rendered shorter than the printing dot line to provide two excess portions at both ends of the head substrate, and the connection terminals are locally arranged within the respective excess end portions without overlapping the drive IC array longitudinally of the head substrate.

Printing head and printer incorporating the same

A pair of holes are formed with a predetermined space therebetween on a long and narrow base plate. An adhesive is applied to the surface of the base plate. Head substrates each having a row of thermal resistors on the surface thereof are placed on the adhesive on the base plate such that the joint of the head substrates is positioned between the pair of holes of the base plate. The adhesive is hardened in the state in which the head substrates are pushed upward by thrusting means inserted into a pair of holes while the base plate is supported from below and the head substrates is pressed from above. The base plate is bonded to a radiating plate by an adhesive only at the central portion. Thus, there is no difference in level at the joint of the head substrates, and even when the radiating plate expands due to heat, the base plate is not deformed.

Method of manufacturing long and narrow electronic part

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Kyoto, Japan

Yoshinobu Kishimoto