Nec Corporation

Yoshinobu Kaneyama

Yuzo Shimada

Sakae Kitajo

Mikio Oda

Masataka Itoh

Masahiko Fujiwara

Junichi Sasaki

Hiroshi Honmou

Masataka Ito

When a substrate electrode ( ) formed on a semiconductor substrate ( ) and a device electrode ( ) formed on an optical device ( ) are joined to each other by solder to mount the device ( ) on the substrate ( ), a solder piece attached to the substrate electrode ( ) is melted in inactive liquid ( ) to form a solder bump ( ). The substrate electrode ( ) on which the solder bump ( ) is formed and the device electrode ( ) are matched with each other, and the device ( ) is disposed so as to confront the substrate ( ) in the inactive liquid ( ). Thereafter, when the solder bump ( ) is melted in the inactive liquid ( ) and ultrasonic vibration ( ) is applied to join the device electrode ( ) and the substrate electrode ( ) to each other, the positioning of the device electrode ( ) to the substrate electrode ( ) is performed by the surface tension of the melted solder bump ( ), and then the solder bump ( ) is solidified.

Device mounting method

The present invention provides a photo-electric combined substrate comprising an electric interconnection part having an electric interconnection layer and an electric insulating layer as well as an optical waveguide part consisting of a core and a clad, where the electric insulating layer in the electric interconnection part and the optical waveguide part are made of the same material; a ceramic substrate comprising an optical device and an electric device where a ceramic substrate has a concave where the concave is filled with a resin, and where at least an optical device is mounted on the ceramic substrate while an electric device on the resin in the substrate concave; and an optical waveguide comprising a core and a clad having a refractive index lower than that of the core, where the core is made of a fluorene-unit-containing epoxy acrylate resin.

Photo-electric combined substrate, optical waveguide and manufacturing process therefor

After an optical element and more preferably both an optical element and an electrical element are mounted on a substrate an upper clad of optical waveguide is formed, covering these elements, and thereby a structure of hermetic seal is achieved through the use of the upper clad

Optical module and manufacturing method thereof

An optical combination of a photoreceptor and an optical fiber, in which a tip surface of the optical fiber and a photoreceiving surface of the photoreceptor is contacted to a surface of the spherical lens so that a light outgoing from the tip surface of the optical fiber into the spherical lens may be totally reflected repeatedly within the spherical lens so as to be incident on the photoreceiving surface of the photoreceptor, resulting in largely simplifying the optical positioning between the photoreceptor and the optical fiber without polishing the tip of the core of the optical fiber into a spherical or semispherical shape in an inexpensive manner.

Optical combination of photoreceptor and optical fiber

Disclosed is a method for fabricating SiO.sub.2 film used as the core layer or cladding layer of an optical waveguide that has the steps of: coating a polysilazane solution on a substrate; and sintering the substrate at a predetermined temperature to form SiO.sub.2 film on the substrate by using the pyrolysis reaction from polysilazane to SiO.sub.2.

Method for fabricating SiO.sub.2 film

In an apparatus for punching a metallic sheet to stamp out a bump and bonding it to a substrate, an AuSn sheet is heated to above a softening point thereof by a heater. A solenoid is energized to cause a punch and a die to stamp out a bump from the AuSn sheet. The bump is directly bonded to a substrate. The punch is made up of a shank portion and a punch portion. A punch holder for guiding the shank portion and punch portion with high accuracy molded integrally with the die. The punch is connected to the solenoid with the intermediary of a damper spring. When the bump hits against the substrate, the damper spring prevents it from chipping off or cracking due to an impact. Subsequently, another solenoid is energized to move the punch further downward, thereby pressing the bump against the substrate for a sufficient period of time.

Growing community of inventors

Tokyo, Japan

Yoshinobu Kaneyama