Ngk Insulators, Inc.

Yoshinobu Goto

Hideyoshi Tsuruta

Yutaka Unno

Hisakazu Okajima

Kazuaki Yamaguchi

Shinji Yamaguchi

Mitsuru Hattori

Yuji Akatsuka

Taiji Kiku

A plasma-resistant member according to the present invention includes a base member formed of a silicon nitride sintered body, an aluminum nitride sintered body, an alumina sintered body, or a silicon carbide sintered body; and a thin film formed on a surface of the base member and composed of an yttrium compound or a spinel, wherein the thin film has, in a surface of the thin film, a plurality of projections for supporting a wafer, and a ratio a/aof a film thickness aof portions of the thin film that include the projections to a film thickness aof portions of the thin film that do not include the projections satisfies 1&#x3c;a/a&#x3c;1.6.

Plasma-resistant member

A ceramic heater includes a disk-shaped ceramic plate and a shaft. The ceramic plate includes a wafer-placing surface. The shaft has a hollow shape and is bonded to a surface of the ceramic plate opposite to the wafer-placing surface. A thermocouple conduit is formed in the ceramic plate so as to extend from a central portion of the ceramic plate to a position which is short of an outer peripheral surface of the ceramic plate. A thermocouple guide having a pipe-like shape is attached to the back surface of the ceramic plate. A guide hole in the thermocouple guide is connected to a portion of the thermocouple conduit at the central portion of the ceramic plate. The guide hole is disposed so as to be inclined with respect to the direction in which the thermocouple conduit extends.

Semiconductor manufacturing apparatus member

The ceramic heaterincludes the ceramic substrateand a hollow shaft. The ceramic substrateis disk-shaped, and a resistance heating elementis embedded in the ceramic substrate. The hollow shaftis attached to the center of a lower surface of the ceramic substrate. The ceramic substratehas a rail grooveto which a slide lidis attached and a guide groovethat serves as a thermocouple conduit. Moreover, a tubeis disposed outside the shaft. The tubeextends in the up-down direction and is connected to the guide groove

Ceramic heater

An electrostatic chuck includes (a) a cooling device serving as an RF electrode, including a gas supply port penetrating through the cooling device, the gas supply port extending from one main surface to the other main surface, and a main counter bore portion having a diameter larger than that of the gas supply port, the main counter bore portion provided in an opening of the gas supply port; (b) an arc prevention member buried in the main counter bore portion and made of an insulating member, wherein a gas path is provided, the gas path is configured to communicate with the gas supply port; and (c) an electrostatic chuck body arranged on the cooling device, defining a work mounting surface on a top surface of the electrostatic chuck body, provided with a pore in communication with the gas supply port via the gas path.

Electrostatic chuck

A resistive heating elementhas a higher molybdenum carbide content in a central portionthan in a peripheral portion. Since molybdenum carbides have a low temperature coefficient of resistance compared to molybdenum, the amount of heat generated in the central portionof the resistive heating elementdoes not increase as much as in the peripheral portioneven when the temperature is increased, and the increase in difference in temperature between the peripheral portionand the central portioncan be suppressed. In other words, generation of hot spots near the center can be suppressed and a good uniform heating property in a wide range of operation temperatures can be obtained.

Ceramic heater and method for making the same

A heating device made of ceramics includes: a plate-like heating base having a heating surface; and a hollow cylindrical support member bonded to a back surface of the heating base. A concave surface portion that connects the back surface of the heating base and an outer surface of the support member smoothly to each other is formed in the vicinity of an outer end of a bonding interface between the heating base and the support member. On a cross section including an axis of the support member, the concave surface portion has a curved line of an arc of a ellipsoid in which a minor axis direction is parallel to an axis direction of the support member.

Heating device for heating a wafer

A first heating element and a second heating element, which are capable of individually controlling temperatures thereof, are embedded in a ceramic base. Each of the first heating element and the second heating element is formed into a spiral shape so as not to contact the other from a central portion of the base to an outer circumferential portion thereof in substantially the same plane parallel to a heating surface of the base. One of the first and second heating elements includes a high heating density portion on the central portion side of the base, and a low heating density portion on the peripheral portion side of the base, and the other of the first and second heating elements includes a low heating density portion on the central portion side of the base, and a high heating density portion on the peripheral portion side of the base.

Heating device

The power-supplying member comprises: a first rod-shaped member connected to at least one of a heating resistor and an electrode; a second rod-shaped member connected to a power supply; and a thermal-function member, which is disposed between the first rod-shaped member and the second rod-shaped member, and which has a smaller axial cross section area and a larger surface area as compared to the first and second rod-shaped members.

Power-supplying member and heating apparatus using the same

A heating device is provided, including a ceramic base in which a resistance heating body is embedded, gas flow passages formed in an inside portion of the base, and adjustment members which vary flow rates of a gas provided in the gas flow passages.

A power-supplying member comprises: a first rod-shaped member connected to power-supplied object; a second rod-shaped member connected to power supply; and a thermal-expansion absorbing member, which is disposed between the first rod-shaped member and the second rod-shaped member, and which shrinks in a longitudinal direction in response to changes in shape of the first rod-shaped member and the second rod-shaped member in the longitudinal direction due to thermal expansion.

A heating device includes a substantially cylindrical shaft joined to a joint surface of a plate-shaped ceramic substrate opposite to a heating surface, the ceramic substrate including a resistance heating element embedded in the ceramic substrate. The shaft includes a flange portion formed in the end joined to the ceramic substrate and a first cylindrical portion connecting to the flange portion, and a ratio DDof an inner diameter Dof a joint area in the flange portion and an outer diameter Dof the first cylindrical portion is not less than 92%.

A manufacturing method for a substrate heating device comprises forming a base plate having a substrate heating surface in which a resistance heating element is buried, forming a tubular member, joining the tubular member to the base plate, measuring temperature distribution in the substrate heating surface by supplying power to the resistance heating element, and grinding the tubular member according to a grinding condition based on a measurement result of the temperature distribution.

Method of manufacturing a substrate heating device

A heating resistancecomprises a shaped body of a band made of a conductive material obtained by bending the band in a shape of a wave. The heating resistanceis fixed to a substrate made of an insulating material to obtain a heater. Alternatively, the heating resistance comprises a wound body of a band made of a conductive material. According to the present invention, the heating value per a unit length can be easily designed and changed, and the reliability can be improved and abnormal heat generation can be prevented at the interface where the heating value per a unit length is changed.

Heating resistances and heaters

A heater includes a heating member formed in a plate shape that includes a substrate-heating surface on which a substrate is mounted and a heating member rear surface which is on the opposite side of the substrate-heating surfaces. The heater also has a resistance heating element embedded therein. An auxiliary member is placed on the side of the heating member rear surface of the heating member and has an opposing surface which opposes the heating member rear surface. A planar gas path for gas ejected on the substrate-heating surface is formed between the heating member rear surface and the opposing surface.

Heater

A substrate heating apparatus is provided, including a base group including a plurality of bases, which are arranged substantially into a plate with a gap interposed between the bases, and which form a substrate mounting surface. A resistance heating element provided for at least one of the bases.

Growing community of inventors

Nagoya, Japan

Yoshinobu Goto