Kabushiki Kaisha Toshiba

Toshiba Electronic Devices & Storage Corporation

Yoshinari Tamura

Jia Liu

Yusuke Imaizumi

Tatsuo Tonedachi

Minoru Takizawa

Masahiko Hori

Mami Fujihara

Daijo Chida

According to one embodiment, an isolator includes: a first semiconductor chip; a second semiconductor chip; a first wiring board including a first surface provided thereon with the first semiconductor chip; a second wiring board including a second surface provided thereon with the second semiconductor chip, the second wiring board being spaced apart from the first wiring board; a third wiring board spaced apart from each of the first and second wiring boards; a first coil on the first surface; a second coil on the second surface; a third coil on a third surface of the third wiring board, the third surface facing the first and second surfaces, the third coil facing the first coil; a fourth coil on the third surface, facing the second coil, and electrically coupled to the third coil; and an insulator provided between the first to fourth coils.

Isolator

According to one embodiment, an isolator includes a first wiring board and a second wiring board. The first wiring board includes a first insulating layer including first and second principal surfaces; a first coil provided on the first principal surface; and a first pad provided on the first principal surface and electrically connected to the first coil. The second wiring board includes a second insulating layer including third and fourth principal surfaces; a second coil provided on the third principal surface; and a second pad provided on the fourth principal surface and electrically connected to the second coil. The first and second coils are arranged in such a manner as to face each other, and an external size of the second wiring board is smaller than an external size of the first wiring board.

According to one or more embodiments, a semiconductor device includes a mounting substrate and a semiconductor element on the mounting substrate. The mounting substrate has a first electrode pad and a second electrode pad. The semiconductor element has a supporting substrate, third and fourth electrode pads, first slits and second slits. The third and fourth electrode pads are provided on a first surface of the supporting substrate facing the mounting substrate. The first slits are provided both in the supporting substrate and in the third electrode pad. The second slits are provided both in the supporting substrate and in the fourth electrode pad. The semiconductor device further includes a first conductive bonding agent that connects the first electrode pad to the third electrode pad and a second conductive bonding agent that connects the second electrode pad to the fourth electrode pad.

Semiconductor device

Growing community of inventors

Yokohama Kanagawa, Japan

Yoshinari Tamura