Taiyo Yuden Co., Ltd.

Yoshinari Take

Hidetoshi Masuda

Kenichi Ota

Tomoyuki Takahashi

Yuichi Sasajima

Kentarou Morito

Yoshio Aoyagi

A capacitor that can make a failure mode into an open mode even when a short circuit caused by insulation breakdown occurs in a dielectric layer is provided. The capacitor includes: a substrate; an MIM structure disposed on the Substrate, the MIM structure including a dielectric layer, a bottom electrode layer disposed on one side of the dielectric layer and composed of a first conductive material, and a top electrode layer disposed on the other side of the dielectric layer; a first external electrode disposed on the substrate; a second external electrode disposed on the substrate; and a connection conductor connecting between the bottom electrode layer and the first external electrode, the connection conductor including a first contact portion contacting the substrate.

Capacitor with connection conductor contacting a surface of a substrate

A ceramic electronic component includes an element body including a dielectric and internal electrodes; a pair of external electrodes respectively formed on side surfaces of the element body, each of the external electrodes including a base layer and a plating layer formed on at least a part of the base layer, the base layer of each of the external electrodes containing metal and being formed to continuously cover a portion of a lower surface of the element body and the corresponding side surface of the element body connected to the lower surface, the base layer of each of the external electrodes being electrically connected to one or more of the internal electrodes; and an insulating layer formed on an upper surface of the element body, the insulating layer having a thickness that is less than a thickness of the plating layer of each of the external electrodes.

Ceramic electronic component, substrate arrangement, and method of manufacturing ceramic electronic component

A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes a first side surface facing in a direction of a first axis, a second side surface facing in a direction of a second axis orthogonal to the first axis, a ridge that connects the first side surface and the second side surface to each other, and internal electrodes laminated along a third axis orthogonal to the first axis and the second axis and led out in a lead-out region. The external electrode includes a protrusion provided at a position along the ridge and protruding in the directions of the first axis and the second axis, and a first base portion and a second base portion extending from the protrusion along the first side surface and the second side surface, respectively, the external electrode covering the lead-out region.

Multi-layer ceramic electronic component and method of producing the same

A trench capacitor according to one embodiment of the present invention includes a base member with an upper surface having a plurality of trenches provided therein and an MIM structure provided on the base member so as to be embedded in the plurality of trenches. In the embodiment, the plurality of trenches include a first trench and a second trench adjacent to the first trench in a first direction orthogonal to a depth direction of the plurality of trenches. The base member includes a first wall separating the first trench from the second trench. The first wall includes a first portion having an acute angle at a distal end thereof in a section including the first direction and the depth direction.

Trench capacitor

A capacitor includes a dielectric layer, a first external electrode layer, a second external electrode layer, a first internal electrode portion, a second internal electrode portion, and a close contact portion. The dielectric layer includes a first surface, a second surface facing the first surface, and a plurality of through-holes communicating between the first surface and the second surface. The first internal electrode portion is provided on a first through-hole portion. The second internal electrode portion is provided on a second through-hole portion. The close contact portion brings at least one of the first external electrode layer and the second external electrode layer into close contact with the dielectric layer, the close contact portion being provided on a third through-hole portion, the third through-hole portion being the remaining portion of the plurality of through-holes.

Capacitor having a plurality of minute internal electrode portions filled by a dielectric layer

A capacitor includes a dielectric layer, a first external electrode layer, a second external electrode layer, a first internal electrode portion, a second internal electrode portion, and an adsorbing portion. The first internal electrode portion is provided on a first through-hole portion, one end of the first internal electrode portion being connected to the first external electrode layer. The second internal electrode portion is provided on a second through-hole portion, one end of the second internal electrode portion being connected to the second external electrode layer. The adsorbing portion adsorbs the first external electrode layer and the second external electrode layer, the adsorbing portion being provided on a third through-hole portion.

Capacitor

Proposed are thin film MIM capacitors with which deterioration of insulating properties and leakage current properties can be sufficiently inhibited. Also proposed is a manufacturing method for the thin film MIM capacitors. For the thin film MIM capacitor (), a lower electrode (), a base metal thin film (), the dielectric thin film () and the upper electrode () are formed to approximately the same area. The lower electrode () has a configuration that differs from the other films to form a part for external connection. The side surface of the base metal thin film (), the dielectric thin film (), and the upper electrode () are covered with a base metal oxide () that comprises the same metal atoms as the base metal thin film ().

Thin film MIM capacitors and manufacturing method therefor

A capacitor forming unit according to one embodiment includes a dielectric plate with a plurality of through holes; a first conductor film formed on an upper surface of the dielectric plate; a first insulator film formed on the front end portion of the upper surface of the dielectric plate; a second conductor film formed on a lower surface of the dielectric plate; a second insulator film formed on the rear end portion of the lower surface of the dielectric plate; first electrode rods disposed in some of the through holes; and second electrode rods disposed in the remaining through holes where the first electrode rods are not disposed. The first electrodes are electrically connected to the first conductor film and electrically insulated from the second conductor film. The second electrode rods are electrically connected to the second conductor film and are electrically insulated from the first conductor film.

Capacitor element and capacitor device having the same

A capacitor forming unit includes a dielectric plate, a first conductor film formed on a plate upper surface region other than front and rear end portions, a first insulator film formed on the upper surface front end portion, a second insulator film formed on the upper surface rear end portion, a second conductor film formed on a plate lower surface region other than front and rear end portion, a third insulator film formed on the front end portion lower surface, and a fourth insulator film formed on the lower surface rear end portion. One or more first electrode rods are disposed in through holes, and electrically connected to the first conductor film and electrically insulated from the second conductor film. One or more second electrode rods are disposed in other through holes, and electrically connected to the second conductor film and electrically insulated from the first conductor film.

Growing community of inventors

Tokyo, Japan

Yoshinari Take