Nitto-denko Corporation

Yoshinari Takayama

Atsushi Hino

Kazuo Ouchi

Amane Mochizuki

Masakazu Sugimoto

Daisuke Kitagawa

Kenichi Tagawa

Takashi Oda

Toshiki Naito

Hideyuki Usui

Tomonari Naito

Kunio Nagasaki

Ichiro Suehiro

Ryoichi Matsushima

Toshikazu Baba

Takafumi Hida

Tetsuya Terada

Takanori Miyoshi

Shoji Morita

Munekazu Tanaka

Yuichi Takamura

Susumu Kiyohara

Ichiro Amino

Mikio Aizawa

Azusa Iseki

Toshio Uota

Asami Kubo

Kimiaki Tauchi

Akira Ishizaki

Kazuto Shinozaki

An adhesive tape includes: a substrate made of a fluorine resin; and a silicone-based adhesive agent layer disposed on one surface of the substrate. The adhesive tape has a thickness of 50 &#x3bc;m or more. An adhesive strength of an adhesive surface to the other surface of the substrate after a friction test is 4.0 N/19 mm or more. The friction test is performed according to a test method for coefficient of friction specified in JIS K7125: 1999, and performed in a state where: a contact surface, of a sliding piece used in the test method, brought into contact with a surface to be tested is covered with a single fiber cloth (cotton, for friction) specified in JIS L0803: 2011; the other surface of the substrate is defined as the surface to be tested; and the number of times of reciprocation is set to 10 times.

Adhesive tape

A disclosed method for producing an elongated filler-containing fluororesin sheet includes: a step (I) of forming a strip member from a strip sheet containing a fluororesin, a filler, and a forming aid; and a step (II) of forming an elongated sheet strip by rolling the strip member in a longitudinal direction of the strip member. In the step (I), the strip member is formed by bending the strip sheet in such a manner that quadrilaterals formed on a surface of the strip member, each defined by two strip member side edges extending in the longitudinal direction of the strip member and two strip sheet side edges of the strip sheet that crosses a region between the two strip member side edges are parallelograms each having an acute angle &#x3b1; as an interior angle and that the parallelograms are arranged in the longitudinal direction of the strip member.

Method for producing filler-containing fluororesin sheet

The present invention provides a thermally-conductive sheet excellent in heat dissipation properties. The thermally-conductive sheet includes a polymer matrix and a thermally-conductive filler dispersed in the polymer matrix. The present invention is a thermally-conductive sheet including a polymer matrix and non-spherical particles of a thermally-conductive filler that are dispersed in the polymer matrix. At least a part of the thermally-conductive filler particles are oriented in a thickness direction of the sheet. When a portion of the sheet where the thermally-conductive filler particles have the highest degree of orientation in the thickness direction of the sheet is defined as a center of orientation, and an axis passing through the center of orientation and perpendicular to sheet surfaces is defined as a central axis of orientation, the thermally-conductive sheet has a region where the thermally-conductive filler particles are oriented toward one point on the central axis of orientation and where the degree of orientation of the thermally-conductive filler particles in the thickness direction of the sheet decreases from the center of orientation toward a periphery of the sheet.

Thermally-conductive sheet, LED mounting substrate, and LED module

The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet ()) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m&#xb7;K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.

LED mounting substrate

An image fixing apparatus using an endless film in which abrasion resistance is largely improved by presence of the high-hardness releasable resin outer layer so that the endless film is provided with practically satisfactory mechanical strength as well as satisfactory abrasion resistance, whereby the image fixing apparatus can obtain a sharp image for a long term; and to provide such an image-fixing endless film for use in the image fixing apparatus.

Image fixing apparatus and thin tube-like endless film having inner and outer layers

In a film carrier with a conductive circuit formed, an opening is formed in a particular position relative to where the conductive path is to be formed. The opening is a through-hole, filled with a conductive material to form a conductive path. The conductive circuit has a concave face, provided according to certain formulae. The film carrier can cope with a fine-pitched and highly dense mounting, while prohibiting pulling out of the conductive path by an external force. The film carrier does not suffer from fallout of the conductive path, and has increased electrical connection reliability.

Film carrier and semiconductor device using same

A method for producing a circuit substrate having a bump contact point, comprising the steps of (a) disposing a positive electrode in a plating solution stored in a storage tank, (b) exposing a conductive circuit formed on an insulating substrate, above the surface of the plating solution, (c) disposing a jet stream opening below the surface of the plating solution, and (d) spouting out the plating solution from the jet stream opening toward the negative electrode for electroplating using said conductive circuit as a negative electrode, to form the bump contact point on the surface of the negative electrode, and a jet stream type plating apparatus used therefor. According to the present invention, mixing of air bubbles in the plating solution can be inhibited, which in turn enables suppression of oxidative decomposition of the brightener components. As a consequence, the bump contact point can have a mushroom shape, and variation in the height of the bump contact points can be minimized. In addition, slip of the vertex of the bump contact point and loss of bump contact points can be avoided.

Method for producing circuit substrate having bump contact point and jet

Multilayer probe for measuring electrical characteristics

Film carrier for fine-pitched and high density mounting and

An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

Process for producing an anisotropic conductive film

Anisotropic conductive film with through-holes filled with metallic

A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed.

Wiring substrate, film carrier, semiconductor device made by using the

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Osaka, Japan

Yoshinari Takayama