Sony Corporation

Sony Electronics Inc

Other

Yoshinari Matsuda

Yoshio Suzuki

Nobutoshi Asai

Ryota Odake

Rogelio Ruiz

Tomohide Koguchi

Ramon Osuma

Ivan Cazarez

A motherboard for an electronic device comprising a main printed circuit board (PCB) with a through-hole extending between the upper component surface and the lower surface. The motherboard includes a carrier PCB having a top surface and a bottom surface, and at least one component, e.g. an optical device, sensor, or the like, coupled to the top surface. The carrier PCB is mounted in an in an inverted orientation with respect to the main PCB such that the top surface of the carrier PCB faces the upper component surface of the main PCB. The carrier PCB is aligned with the main PCB such that the component is substantially aligned with the through hole of the main PCB and is visible from the lower surface of the PCB.

Downward-facing optical component module

A TV with Internet communication capability includes a built-in microphone and video camera. Signals from the microphone and video camera are processed by an IP phone module in the TV, multiplexed together, and sent over the Internet to one or more user-selected addresses. Incoming videoconferencing signals are demultiplexed and presented on the TV display and speaker.

TV with internet videoconferencing

A surface mount device jumper includes a base member and an electrode member. The base member is fabricated from a resin laminate. The electrode member is fabricated from an electrically-conductive material and is formed in a generally C-shaped configuration to define an opening therethrough. The opening is sized to receive the base member such that the electrode member partially wraps around and clamps to the base member to retain the base member in the opening.

Surface mount device jumper and surface mount device jumper assembly

A printed wiring board on which a pattern can be formed favorably by printing and soldering even where a small part of thesize or less is mounted. The printed wiring board includes a substrate; a pair of soldering lands on the substrate, the soldering lands being spaced from one another with a first side of one land opposing a first side of another land; and a mounted part having a pair of electrodes on opposite ends thereof soldered to the respective lands. A wiring line is connected to each soldering land, and an insulating element overlies the wiring lines. The insulating element has openings formed so as to expose the soldering lands therethrough. Wiring line connection elements are individually connected to only the first sides of the lands. Each insulating element opening has an edge positioned outside of the corresponding land and on the inner side of the corresponding wiring line connection element.

Printed wiring board and fabrication method for printed wiring board

A printed wiring board includes a glass substrate provided with through-holes, conductive patterns provided on both surfaces of said glass substrate in such a manner as to be made conductive to each other via said through-holes, and a sealing member composed of a silver paste containing an epoxy resin as a binder provided to fill said through-holes. This printed wiring board is advantageous in that circuit parts can be connected to each other without use of any planar special region and moisture does not reach the circuit parts through the printed wiring board. A display apparatus capable of stably displaying pictures for a long-period of time is provided by using the printed wiring board.

Printed wiring board and display apparatus

An apparatus for electrically connecting an electronic element and a base includes an electrode region and a terminal region proximate the electrode region. A conductive paste is deposited on at least a portion of the terminal region. The conductive paste has an oxidation-reduced region thereon, formed by application of an acid to the conductive paste. An oxidation-prevention layer is formed on the oxidation-reduced region by deposition of a flux on the oxidation-reduced region, application of a solder to the flux, and blowing of a heated gas by the solder. The oxidation-prevention layer is adapted to bond the electrode associated with the electronic element to the conductive paste by soldering, when the electrode is present in the electrode region.

Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board

An organic electroluminescent (EL) display, wherein fabrication is simplified, manufacturing cost is reduced, periodicity with which pixels are arrayed is maintained, picture quality is prevented from deteriorating due to a boundary between transparent substrates, and high resolution is realized. A plurality of organic thin film EL display elements are formed on a single transparent substrate. Circuit substrates on which driver circuits for supplying signals to signal and scanning electrodes for each of the EL display elements are mounted are bonded to the EL display elements. The circuit substrate has an end-sealing property and through holes are bored opposite the signal and scanning electrodes. The through holes are covered by a conductive, end-sealing material. Signals are supplied from the driver circuit to the signal and scanning electrodes through the conductive material. A portion of the organic EL display element that is not bonded to the circuit substrate is covered by an end-sealing material.

Direct-view-type display apparatus

An organic EL display, wherein fabrication is simplified, manufacturing cost is reduced, periodicity with which pixels are arrayed is maintained, picture quality is prevented from deteriorating due to a boundary between transparent substrates, and high resolution is realized. A plurality of organic thin-film EL elements ( ) are formed on a single transparent substrate ( ). Circuit substrates ( ) in which driver circuits (6) for supplying signals to signal and scanning electrodes of the elements ( ) are mounted are bonded to the elements ( ). The circuit substrate has an end-sealing property and through-holes bored opposite the signal and scanning electrodes. The through-holes are covered by a conductive, end-sealing material. Signals are supplied from the driver circuit ( ) to the signal and scanning electrodes through the conductive material. A portion of the organic EL element which is not bonded to the circuit substrate is covered by an end-sealing material.

Copper foil lands provided with a through-hole filled with a copper paste are provided with ring-formed hollow portions in the periphery of the through-hole where exfoliation between the copper paste and the copper foil lands normally occurs to obtain a copper-plated through-hole in both sides of a printed wiring board using a paper-phenol substrate, wherein adhesion strength between the copper foil lands and the copper paste is enhanced.

Adhesion strength between conductive paste and lands of printed wiring board, and manufacturing method thereof

The present invention is for providing a rigid-printed wiring board capable of preventing the burst or void phenomenon of a copper paste, and a production method of the rigid-printed wiring board. A rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein a through hole is provided in the vicinity of a via hole for filling the copper paste, is provided.

Rigid-printed wiring board and production method of the rigid-printed wiring board

An optical device used as an image panel which is allowed to be arranged together with the adjacent one on a display without a gap put therebetween and which is improved to form a stacked body including organic layers without damaging the surface of an already-formed organic layer by a vapor-deposition mask, and to provide a method of manufacturing the optical device. Metal bumps are provided on stripes of transparent electrodes arranged on a glass substrate in such a manner as to be located in non-optical operation regions, and are led on the back surface of the organic EL device. The metal bumps function as spacers upon vapor-deposition of the organic layer or the like, to prevent the contact of a vapor-deposition mask with an already-formed film surface, and are led on the back surface of the organic EL device together with metal electrodes and are connected to an electronic part mounted on the back surface side of the organic EL device.

Method of manufacturing optical device which overlies optical operation regions

A printed wiring board in which control of a characteristic impedance of a signal transmission pattern is realized. The printed wiring board includes a flat plate base material, a signal transmission pattern provided on at least one surface of the base material for transmitting a high frequency signal, an insulator layer formed with a constant thickness to cover the signal transmission pattern, and a grounded control unit provided on the insulator layer opposing the signal transmission pattern for controlling a characteristic impedance of the signal transmission pattern.

Printed wiring board and manufacturing method of the printed wiring board

An optical device used as an image panel which is allowed to be arranged together with the adjacent one on a display without a gap put therebetween and which is improved to form a stacked body including organic layers without damaging the surface of an already-formed organic layer by a vapor-deposition mask, and a method of manufacturing the optical device. Metal bumps are provided on stripes of transparent electrodes arranged on a glass substrate in such a manner as to be located in non-optical operation regions, and are led on the back surface of the organic EL device. The metal bumps function as spacers upon vapor-deposition of the organic layer or the like, to prevent the contact of a vapor-deposition mask with an already-formed film surface, and are led on the back surface of the organic EL device together with metal electrodes and are connected to an electronic part mounted on the back surface side of the organic EL device.

Optical device with conductive projections in non-optical operation regions

The present invention provides an organic thin film EL which can reduce a non-display area when using a plurality of display panels as a single screen, and can prevent a generation of migration. In a flat display device ( ) laminating a display material and electrodes ( ) and ( ), a driver circuit connected to these electrodes ( ) and ( ) is arranged inside a sealing member ( ) covering a back surface of the flat display device ( ), and wirings ( ) and ( ) for connecting a power supply circuit and a signal supply circuit to the driver circuit are led from the inside of the sealing member ( ) to the back side of the flat display device ( ).

Flat display device and wiring method thereof, and image display system

The present invention is for providing a rigid-printed wiring board capable of preventing the burst or void phenomenon of a copper paste, and a production method of the rigid-printed wiring board. A rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein a through hole is provided in the vicinity of a via hole for finning the copper paste, is provided.

Growing community of inventors

Kanagawa, Japan

Yoshinari Matsuda