Adv Antest Corporation

Yoshinari Kogure

Kiyoto Nakamura

Takashi Fujisaki

Yasuhide Takeda

Seiichi Takasu

Sadaki Tanaka

A test carrier includes a base member and a cover member between which a die is interposed. The base film of the base member has: first interconnect patterns which are formed in advance; and a printing region where second interconnect patterns which electrically connect to the first interconnect patterns are to be formed by printing.

Test carrier

A test carrier includes a film-shaped base film which has first bumps which contact test pads of a die; and a cover film which is superposed over the base film, and the test carrier holds the die between the base film and the cover film. The first bumps are relatively higher than second bumps which the die has.

[Problem] A carrier assembly apparatus which is able to be streamlined in structure is provided. [Solution] The carrier assembly apparatuscomprises: an assembly tablewhich supports a base memberon which a dieis placed, a holding headwhich holds a cover member, a pressure reduction headwhich has a pressure reduction chamberaccommodating the cover memberand having an opening partand which abuts against the assembly tableso as to form a sealed space, a first elevating actuatorwhich simultaneously move the holding headand the pressure reduction headto the assembly table, and a second elevating actuatorwhich moves the holding headrelative to the pressure reduction head

Carrier assembly apparatus

A test carrierA comprises: a base boardA which holds a die; and a cover boardA which is laid over the base boardA so as to cover the die. The test carrierA comprises a seal memberwhich is interposed between the base boardA and the cover boardA and which surrounds the die

Test carrier and board assembly

[Problem] A test carrier able to secure a high air-tightness is provided. [Solution] A test carriercomprises a cover memberA and a base memberA which are bonded together while sandwiching a diebetween them. ultraviolet rays can pass through the cover memberA.

[Object] To provide a carrier disassembling apparatus capable of disassembling a carrier for test. [Means for solving] A carrier disassembling apparatus, which disassembles a carrier for test, comprises a holding headthat holds a cover member, a holding tablethat holds a base member, and a first carrier armthat causes the holding headto depart relatively from the holding tableto separate the cover memberand the base memberfrom each other, the holding headhas a first closing memberthat forms a first closed spacebetween the holding headand the cover member, the holding tablehas a second closing memberthat forms a second closed spacebetween the holding tableand the base member, and the carrier disassembling apparatusfurther comprises a vacuum pumpthat reduces pressure within the closed spacesand

Carrier disassembling apparatus and carrier disassembling method

The electronic device mounting apparatuscomprises: a first camerafor imaging a flexible boardof a base memberof a test carrierto generate a first image information; an image processing apparatusfor detecting a position of an alignment markof the flexible boardfrom the first image information and calculating a print start positionof the first interconnect patternson the flexible boardon the basis of the position of the alignment mark; a printing headfor forming a first interconnect patternon the flexible boardfrom the print start position; and a second conveyor armfor mounting a dieon the flexible boardon which the first interconnect patternis formed.

Electronic device mounting apparatus and method of mounting electronic device

Provided is a manufacturing apparatus that manufactures an integrated circuit package by packaging an integrated circuit chip, the manufacturing apparatus comprising a flattening section that flattens the integrated circuit chip; a holding section that holds a base substrate; a transporting section that transports the flattened integrated circuit chip to load the integrated circuit chip on the base substrate held by the holding section; and a packaging section that packages the integrated circuit chip and the base substrate as the integrated circuit package.

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Saitama, Japan

Yoshinari Kogure