Matsushita Electric Industrial Co., Ltd.

Yoshimitsu Aizono

Shigeru Narakino

Kyo Niwatsukino

Toshisuke Sakai

Shinya Koga

Toshiyuki Kubota

Toshihiko Matsuda

Seiji Urano

Fuminori Hirakawa

Makoto Nishida

Youichi Syukuri

Kazuyuki Kasahara

Masashi Hirose

Yoichi Shukuri

A cooling device for cooling a heat-generating component includes a circulating passage arranged to have coolant circulate therein, a centrifugal pump including a first case made of metallic material, a second case made of resin material, and an impeller accommodated in the pump chamber, and a radiator provided at the circulating passage and being operable to release heat from the coolant. The first case has a surface arranged to contact the heat-generating component. The second case forms a pump chamber between the first case and the second case. The pump chamber stores the coolant therein. The impeller includes open-type vanes arranged to pressurize the coolant as to have the coolant flow through the circulating passage. The cooling device has a high cooling efficiency as well as a high operating efficiency of the motor while having a simple construction and a small overall size and a small thickness.

Cooling device and an electronic apparatus including the same

Radiator

A brushless DC motor includes a substrate fixed to the center of a stator core. The substrate includes a central substrate portion and an arm substrate portion extending from the central substrate to a salient pole. The arm substrate is accommodated between coils. A driver IC is mounted on the central substrate portion, and a magnetic pole position sensor is mounted on the arm substrate portion. This structure provides a thin brushless DC motor which assures good motor performance and stable noise and vibration levels, improves motor efficiency, and reduces the number of components and assembling steps.

Brushless DC motor, pump, and electronic apparatus

A pump for circulating a coolant has a housing thereof in direct thermal connection with an electronic component. This provides both the improvement of cooling efficiency of a cooling device and the realization of a compact, slim design of the device.

An ultra-thin pump of the present invention includes a ring-shaped impeller including many vanes arranged along its outer region and a rotor magnet at its inner region, a motor stator provided in a space encircled by an inner peripheral surface of the rotor magnet of the impeller, and a pump casing that includes a suction port, a discharge port and a cylinder disposed between the motor stator and the rotor magnet and houses the impeller. The impeller is rotatably supported by the cylinder. A cooling system of the present invention includes a cooling device for cooling a heat-producing device by heat exchange using coolant, a radiator for removing heat from the coolant, and the ultra-thin pump for circulating the coolant. The ultra-thin pump is simple in structure, operates efficiently and can be manufactured at low cost, and the cooling system is thin in structure and performs efficient cooling.

Ultra-thin pump and cooling system including the pump

A circulation path, a radiator and a reserve tank which can remove air bubbles from the fluid passageway, constitute parts of a closed circulation path, and are formed by joining a flow path wall-forming radiation board on which curved surfaces as flow path walls are formed, with a flat plate-like flow path wall-forming radiation board as another curved surface by welding or the like. Therefore, the efficiency of heat exchange of a cooling apparatus for electronic equipment can be improved, removal of air bubbles from the flow passageway and reduction in size, weight and thickness is made possible without causing air lock.

Cooling apparatus for electronic equipment

Pump for circulating coolant in electronic devices

Growing community of inventors

Ogori, Japan

Yoshimitsu Aizono