Nec Corporation

Yoshimichi Sogawa

Takao Yamazaki

Sakae Kitajo

Ichiro Hazeyama

Masahiro Kubo

Hidehiko Kuroda

Hirobumi Inoue

Seiji Kurashina

Masahiko Sano

Tomohiro Nishiyama

Yuji Akimoto

Toshiaki Shironouchi

Kenji Ohyachi

The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.

Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package

The present invention is directed to provide a semiconductor package and the like realizing reduced manufacturing cost and improved reliability by enhancing a ground line and/or a power supply line. A semiconductor packageincludes: a semiconductor deviceincluding a circuit face on which an external electrode is formed; an insertion substrateforming a housing part in which the semiconductor deviceis disposed; and an interposer substrateincluding a wiring patternand whose both ends are bent along the insertion substrate. The insertion substrateis made of a conductive material and is electrically connected to a ground line or a power supply line in the wiring patternin the interposer substrate

Electronic device package, module, and electronic device

There is provided an electronic device package and the like in which it is not likely that damage occurs in a wiring pattern of an interposer substrate in a gap section formed, for example, between an electronic device and an insertion substrate. The semiconductor package in accordance with the present invention is a package of fan-out type including an interposer substrate and a semiconductor device and an insertion substrate which are arranged on the substrate. The interposer substrateincludes a wiring pattern therein. A gap is formed between the semiconductor device and the insertion substrate; in an area corresponding to the gap, a reinforcing member (a metallic film) is formed to increase strength of the wiring pattern.

Electronic package device, module, and electronic apparatus

A vacuum package has a chamber in which pressure is reduced to less than the atmospheric pressure, a functional component sealed in the chamber, and a material forming at least a part of the chamber. The material has at least one through hole to evacuate the chamber. In a cross section perpendicular to the material taken along the through hole, an edge portion of the material forming the through hole has an obtuse angle. The through hole is sealed with a sealing material.

Vacuum package and manufacturing process thereof

A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.

Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus

A semiconductor package has a semiconductor device chip and a flexible substrate having a thermoplastic insulating resin layer. An electrode provided on the flexible substrate is connected to a predetermined electrode of the semiconductor device chip and sealed by the thermoplastic insulating resin layer. The flexible substrate is bent and provided with electrodes on the electrode-bearing and other surfaces. The flexible substrate has multi-layered wirings. Grooves or thin layer portions having a different number of wiring layers are formed at bends of the flexible substrate or regions including the bends, thereby creating a cavity at a portion in which a semiconductor device is packaged. Then, the flexible substrate is bent at predetermined positions to form a semiconductor package which does not depend on the outer dimensions of the semiconductor device chip.

Growing community of inventors

Tokyo, Japan

Yoshimichi Sogawa