Asahi Kasei Kabushiki Kaisha

Asahi Kasei E-Materials Corporation

Asaki Kasei E-Material Corporation

Yoshimichi Mitamura

Masatoshi Maeda

Norikiyo Nakagawa

Takuto Nakata

Masaru Suzuki

Jun Koike

Fujito Yamaguchi

Kazuyuki Furuya

A heat-reactive resist material contains copper oxide, and silicon or silicon oxide, and is formed so that the content of silicon or silicon oxide in the heat-reactive resist material is 4.0 mol % or more less than 10.0 mol % in terms of mole of silicon. A heat-reactive resist layer is formed using the heat-reactive resist material, is exposed, and then, is developed with a developing solution. Using the obtained heat-reactive resist layer as a mask, dry etching is performed on a substrate with a fluorocarbon to manufacture a mold having a concavo-convex shape on the substrate surface. At this point, it is possible to control a fine pattern comprised of the concavo-convex shape.

Heat-reactive resist material, mold manufacturing method, mold, development method and pattern formation material

A seamless mold manufacturing method of the invention is a seamless mold manufacturing method having the steps of forming a thermal reaction type resist layer on a sleeve-shaped mold, and exposing using a laser and developing the thermal reaction type resist layer and thereby forming a fine mold pattern, and is characterized in that the thermal reaction type resist layer is comprised of a thermal reaction type resist having a property of reacting in predetermined light intensity or more in a light intensity distribution in a spot diameter of the laser.

Seamless mold manufacturing method

A fine concavo-convex structure product () is provided with an etching layer (), and a resist layer () comprised of a heat-reactive resist material for dry etching provided on the etching layer (), a concavo-convex structure associated with opening portions () formed in the resist layer () is formed in the etching layer (), a pattern pitch P of a fine pattern of the concavo-convex structure ranges from 1 nm to 10 &#x3bc;m, a pattern depth H of the fine pattern ranges from 1 nm to 10 &#x3bc;m, and a pattern cross-sectional shape of the fine pattern is a trapezoid, a triangle or a mixed shape thereof. The heat-reactive resist material for dry etching has, as a principal constituent element, at least one species selected from the group consisting of Cu, Nb, Sn, Mn, oxides thereof, nitrides thereof and NiBi.

Fine concavo-convex structure product, heat-reactive resist material for dry etching, mold manufacturing method and mold

In an optical substrate (), a concave-convex structure () including a plurality of independent convex portions (to) and concave portions () provided between the convex portions (to) is provided in a surface. The average interval Pave between the adjacent convex portions (to) in the concave-convex structure () satisfies 50 nm&#x2266;Pave&#x2266;1500 nm, and the convex portion () having a convex portion height hn satisfying 0.6 h&#x2267;hn&#x2267;0 h for the average convex portion height Have is present with a probability Z satisfying 1/10000&#x2266;Z&#x2266;1/5. When the optical substrate () is used in a semiconductor light-emitting element, dislocations in a semiconductor layer are dispersed to reduce the dislocation density, and thus internal quantum efficiency IQE is improved, and a waveguide mode is removed by light scattering and thus the light the extraction efficiency LEE is increased, with the result that the efficiency of light emission of the semiconductor light-emitting element is enhanced.

Optical substrate, semiconductor light-emitting element and method of manufacturing semiconductor light-emitting element

A heat-reactive resist material of the invention is characterized in that the boiling point of the fluoride of the element is 200&#xb0; C. or more. By this means, it is possible to achieve the heat-reactive resist material having high resistance to dry etching using fluorocarbons to form a pattern with the deep groove depth.

Heat-reactive resist material, layered product for thermal lithography using the material, and method of manufacturing a mold using the material and layered product

In order to provide a copper oxide etchant and an etching method using the same capable of selectively etching exposure/non-exposure portions when laser light exposure is performed by using copper oxide as a thermal-reactive resist material, the copper oxide etchant for selectively etching copper oxides having different oxidation numbers in a copper oxide-containing layer containing the copper oxide as a main component contains at least a chelating agent or salts thereof.

Growing community of inventors

Tokyo, Japan

Yoshimichi Mitamura