Fujitsu Corporation

Yoshimi Watanabe

Hidenao Nakajima

Naoki Matsuoka

Hiroshi Tomonaga

Masafumi Katoh

Masaaki Kawai

Hitoshi Yokemura

Hiroyuki Otaguro

Takayuki Ashida

Shuuhei Fujita

A circuit board packaging structure comprises a plurality of circuit boards disposed in parallel to each other and each packaged with electric circuit parts. The circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on the other circuit boards is disposed outermost among the plurality of circuit boards. The surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside the structure.

Circuit board packaging structure

A plurality of switching modules arrayed in a plurality of columns and in at least one row switch over paths in accordance with path data contained in cells to transfer inputted data to a target line on the cell-unit. One or more path switching units are provided between two adjacent columns of switching modules among plural columns of switching modules and switch paths between the respective switching modules, disposed in a side-by-side relationship in a row direction, of one column of switching modules of the two adjacent columns of switching modules and the respective switching modules, disposed in the side-by-side relationship in the row direction, of the other column of the two adjacent columns of switching modules.

ATM switch and method for switching path by ATM switch

Growing community of inventors

Kawasaki, Japan

Yoshimi Watanabe