Shin-etsu Chemical Co., Ltd.

Yoshimi Ogushi

Susumu Ueno

Hitoshi Arai

Osamu Matsumoto

Kiyoshi Imai

Yoshitugu Eguchi

Masaru Miyashita

Niichiro Suzuki

Nobuhiro Ohta

A covered lead wire for vehicles, comprising a cover comprising a composition containing;

Covered lead wire for vehicles

The copper-foiled laminated sheet of the invention is used to prepare a printed circuit sheet having see-throughness after patterning by etching of the copper foil. Different from conventional copper-foiled laminates using an electrolytic copper foil having a surface roughness of 10 or larger, the inventive laminate is prepared using a rolled copper foil having a surface roughness of 1.5 to 5 so that the surface of the adhesive layer, from which the copper foil has been removed by etching, has no undue roughness as a replica of the copper foil surface not to irregularly diffuse the light giving a parallel light-beam transmission of at least 50% and overall light transmission of at least 70% to ensure good see-through visibility.

Copper-foiled laminated sheet for flexible printed circuit board

The invention provides a flexible metal-foiled laminate of an insulating base film of a synthetic resin, e.g. polyimide, and a metal, e.g. copper, foil adhesively bonded together and suitable for use as a base plate for printed circuit boards by virtue of the high heat resistance and greatly increased adhesive bonding strength between the base film and the metal foil. The laminate is prepared by use of a silicone-based adhesive and the surface of the base film is, prior to adhesive bonding, subjected to a treatment of exposure to an atmosphere of low temperature plasma generated in a gaseous organosilicon compound such as trimethyl ethoxy silane, optionally, diluted with an inorganic gas such as oxygen.

Heat-resistant flexible laminate for substrate of printed circuit board

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Saitama, Japan

Yoshimi Ogushi