Murata Manufacturing Co., Ltd.

The Furukawa Electric Co., Ltd.

Yoshimasa Nishi

Sunao Fukutake

Takeo Uno

Yuko Okuno

Takahiro Tsuruta

Tomohiro Nagai

Kanto Iida

Akira Moriya

A multilayer resin substrate includes resin layers that are laminated, a first copper foil on the resin layers and including first and second main surfaces having first and second surface roughnesses, respectively, and a second copper foil on the resin layers and including third and fourth main surfaces having third and fourth surface roughnesses, respectively. A distance between the first main surface and the second copper foil is shorter than a distance between the second main surface and the second copper foil. When the first, second, third, and fourth surface roughnesses are denoted as SR, SR, SR, and SRrespectively, a relationship SR<SR≤SR<SRis satisfied.

Multilayer resin substrate and method for producing same

Provided is a surface-treated copper foil excellent in laser processability. The surface-treated copper foil includes a roughened surface formed by subjecting a surface to a roughening treatment, in which when measured using a three-dimensional roughness meter, the roughened surface has a surface skewness Ssk within a range of from &#x2212;0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nmto less than 0.0300 nm.

Surface-treated copper foil, and copper-clad laminate and circuit board using same

A black liquid-crystal polymer film that contains a black pigment and a liquid crystal polymer and the black liquid-crystal polymer film has a lightness of 45 or less, a dielectric loss tangent of 0.0035 or less, a minimum dielectric breakdown strength of 60 kV/mm or more, and a maximum-to-minimum ratio of in-plane thermal linear expansion coefficient in the range of 1.0 to 2.5.

Black liquid-crystal polymer film and multilayer board

A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 &#x3bc;m or more and 0.30 &#x3bc;m or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.

Growing community of inventors

Kyoko, Japan

Yoshimasa Nishi