Seiko Epson Corporation

Epson Toyocom Corporation

Seiko Epson Corportion

Yoshikuni Saito

Taketo Chino

Nobuyuki Imai

Yusuke Kinoshita

Fumikazu Otani

Yoshihiro Kobayashi

Masayasu Sakuma

Keita Ito

A sensor module includes an X-axis angular velocity sensor device that outputs digital X-axis angular velocity data, a Y-axis angular velocity sensor device that outputs digital Y-axis angular velocity data, a Z-axis angular velocity sensor device that outputs digital Z-axis angular velocity data, an acceleration sensor device that outputs digital X-axis, Y-axis, and Z-axis acceleration data, a microcontroller, a first digital interface bus that electrically connects the X-axis angular velocity sensor device, the Y-axis angular velocity sensor device, and the Z-axis angular velocity sensor device to a first digital interface, and a second digital interface bus that electrically connects the acceleration sensor device to a second digital interface.

Sensor module, measurement system, and vehicle

A sensor module includes a first sensor device that outputs first measurement data from a first measurement circuit receiving a signal from a first sensor element and performing a measurement process, a second sensor device that outputs a second measurement circuit receiving a signal from a second sensor element and performing a measurement process, and a microcontroller that receives the first measurement data and the second measurement data, in which the first sensor device includes a first terminal that is used for input of an external synchronization signal or a synchronization signal which is a signal based on the external synchronization signal, and input or output of a communication signal, and the second sensor device includes a second terminal that is used for input of the synchronization signal, and input or output of the communication signal.

Sensor module, electronic apparatus, and vehicle

A sensor unit includes a circuit board including, on a first surface, a plurality of electrode pads to which a plurality of mounting terminals of an inertial sensor are respectively attached via connecting members. The first surface of the circuit board includes an insulating layer provided on the outer side of the plurality of electrode pads in a plan view, includes, in a portion overlapping a center region further on the inner side than the mounting terminals of the inertial sensor in the plan view, a first region where the insulating layer is not provided, and includes, from the first region to the outer side of the inertial sensor in the plan view, a second region where the insulating layer is not provided.

Sensor unit, vehicle positioning device, and vehicle

A sensor module includes a first sensor device, a second sensor device, and a microcontroller. The first sensor device includes a first synchronization terminal to which an external synchronization signal or a synchronization signal which is a signal based on the external synchronization signal is input, a first interface outputs first measurement data to the microcontroller on the basis of the synchronization signal which is input to the first synchronization terminal, the second sensor device includes a second synchronization terminal to which the synchronization signal is input, and a second interface outputs second measurement data to the microcontroller on the basis of the synchronization signal which is input to the second synchronization terminal.

Sensor module, measurement system, electronic apparatus, and vehicle

A sensor unit includes: a sensor device including an inertial sensor; a substrate to which the sensor device is bonded; a case member accommodating at least the sensor device; and an adhesive member provided to cover, in a plan view of the substrate as viewed from the case member side, an outer periphery of the sensor device and so as to connect the sensor device with the case member.

Sensor unit having an adhesive member connected to an outer edge of a sensor device and placed continuously in an area overlapping a sensor device

A board main body of a board has a sensor mounting area, in which a physical quantity sensor is mounted, disposed on a surface. A non-electrode forming part and a plurality of electrodes are disposed in the sensor mounting area, the electrodes being disposed so as to be isolated from each other, and to correspond to mounting terminals of the physical quantity sensor. A shield electrode is disposed outside the sensor mounting area.

Mounting board, sensor unit, electronic apparatus, and moving body

A sensor unit includes sensors. Each of the sensors provides a measurement axis. A connector is electrically connected with the sensors. The position of the connector is fixed relative to the sensors. A memory unit stores calibration information which specifies the respective directions of the measurement axes with respect to a reference plane established for the connector.

Sensor unit, electronic device, and moving body

A sensor unit is provided with a sensor device. The sensor device has a first electrode disposed on an outer surface. A board is provided with a first surface and a second surface in an obverse-reverse relationship with each other, and a side surface. A first conductive terminal is disposed along a contour of the first surface. The sensor device has the outer surface disposed along the side surface of the board, and has the first electrode connected to the first conductive terminal with a first conductive body, and a first projection length of the outer surface projecting on the first surface side is smaller than a second projection length of the outer surface projecting on the second surface side.

Sensor unit, method of manufacturing the same, electronic apparatus, and moving object

A method for manufacturing an acceleration sensing unit includes: providing an element support substrate in which a plurality of element supporting members is arranged so as to form a plane, each of the element supporting members being coupled to the other element supporting member through a supporting part and having a fixed part and a movable part that is supported by the fixed part through a beam, the beam having a flexibility with which the movable part is displaced along an acceleration detection axis direction when an acceleration is applied to the movable part; providing an stress sensing element substrate in which a plurality of stress sensing elements is arranged so as to form a plane, each of the stress sensing elements being coupled to the other stress sensing element through an element supporting part and having a stress sensing part and fixed ends that are formed so as to have a single body with the stress sensing part at both ends of the stress sensing part; disposing the stress sensing element substrate on the element support substrate such that the fixed ends of each stress sensing element are situated on the fixed part and the movable part; fixing the fixed ends onto the fixed part and the movable part, and dividing the element supporting part and the supporting part.

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Suwa, Japan

Yoshikuni Saito