National Institute of Advanced Industrial Science and Technology

Kiyota Manufacturing Co.

Kiyoto Manufacturing Co.

Shinwa Corp. Ltd.

Tss Corporation

Kabushiki Kaisha Mikuni Kogyo

Yoshikuni Okada

Masahiro Aoyagi

Hiroshi Nakagawa

Katsuya Kikuchi

Kazuhiko Tokoro

Shigeo Kiyota

Hiroyuki Fujita

Kenichi Kobayashi

Yoshihiro Gomi

Hirotaka Oosato

Shouichi Imai

Shoichi Imai

A method of making a contact probe including a step of making a first printed wiring board having a signal electrode and a ground electrode used as a contact part of the contact probe with respect to a measuring object, in which the signal electrode and ground electrode are formed of a metal wiring pattern, and making a second printed wiring board with a coaxial line structure having a shield electrode which encloses a signal line and the surroundings of the signal line through an insulating layer. The signal electrode of the first printed wiring board and the signal line of the second printed wiring board are electrically connected together, and the ground electrode of the first printed wiring board and the shield electrode of the second printed wiring board are electrically connected together.

Method of making contact probe

To provide a contact probe which can easily be connected with a measurement apparatus electrically, can measure a high speed and high frequency signal with a fine pitch easily and correctly, and can easily cope with signal measurement for a plurality of channels, and a method of making the contact probe. It includes a first printed wiring boardhaving a signal electrodeand a ground electrodeused as a contact part with respect to a measuring object, in which the signal electrodeand ground electrodeare formed of a metal wiring pattern on a substrate, and a second printed wiring boardwith a coaxial line structure having shield electrodeswhich enclose a signal lineand the surroundings of the signal linethrough an insulating layer. The signal electrodeof the first printed wiring boardand the signal lineof the second printed wiring boardare electrically connected together, and the ground electrodeof the first printed wiring boardand the shield electrodesof the second printed wiring boardare electrically connected together.

Contact probe and method of making the same

An interposer having multi-layer fine wiring structure which comprises an insulating layer made of photosensitive polyimide which is photosensitive organic material and a wiring layer portion made of metal, such as copper, silver, gold, aluminum, palladium, indium, titanium, tantalum, and niobium, functions as wiring in an integrated circuit chip, wherein junctions between the integrated circuit chip and the interposer are formed by micron to submicron size fine connection metal pads or bumps which are formed on both the integrated circuit chip and the interposer.

Multi-layer fin wiring interposer fabrication process

The present invention provides a method of forming a micro metal bump, which is capable of stably and industrially forming a micro metal bump, by a gas deposition process, at a prescribed position of a metal part formed on one side surface of a substrate. The method comprises the steps of: forming a straight hole () in a mask layer () covering one side surface of a substrate () on which a wiring pattern () is formed, wherein a prescribed position of the wiring pattern () is exposed in a bottom surface of the straight hole and the straight hole has an inner wall perpendicular to the one side surface of the substrate () and a sharp top opening portion; providing a metal plate, whose area is larger than that of the substrate (), on the other side surface of the substrate () as a heat sink; placing the substrate () and the metal plate in a vacuum; forming a tapered metal bump () on the exposed surface of the wiring pattern (), which is exposed in the bottom surface of the straight hole (), by a gas deposition process, in which metal nanoparticles obtained by evaporating a metal are ejected from a nozzle together with a carrier gas so as to deposit on the prescribed position, with cooling the substrate () to a temperature lower than upper temperature limit of resin constituting the mask layer (), by the metal plate as the heat sink, so as to retain a configuration of the straight hole (); and removing the mask layer () from the one side surface of the substrate so as to complete the tapered metal bump () at the prescribed position of the wiring pattern ().

Method of forming micro metal bump

A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package through the printed wiring board; and analyzing means for analyzing a signal detected by the output signal detecting means, wherein by contacting the contact electrode of the contact probe with an electrode pad formed on the LSI chip, the evaluation signal is inputted to the LSI chip not through metallic wiring within the LSI package.

System in-package test inspection apparatus and test inspection method

There is provided a contact probe that is smaller than 50 &#x3bc;m in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrodeand a ground electrodethat are put into contact with an object to be measured; and a coaxial cablehaving a coreelectrically connected to the signal electrodeand an outer covering conductor la electrically connected to the ground electrode, wherein the tip member is formed on a printed wiring board, and wherein the signal electrodeand the ground electrodeare constructed of fine coplanar strip lines formed on an insulating board

Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe

There is provided a contact probe that is smaller than 50 &#x3bc;m in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrodeand a ground electrodethat are put into contact with an object to be measured; and a coaxial cablehaving a coreelectrically connected to the signal electrodeand an outer covering conductorelectrically connected to the ground electrode, wherein the tip member is formed on a printed wiring board, and wherein the signal electrodeand the ground electrodeare constructed of fine coplanar strip lines formed on an insulating board

Growing community of inventors

Tsukuba, Japan

Yoshikuni Okada