Mitsubishi Electric Corporation

Yoshiko Fujima

Masahiro Nigo

Kohei Sato

Takuya Matsuda

Shunsuke Sasaki

Takeru Kuroiwa

Yusuke Morimoto

Toshiki Asai

Akihisa Yokoyama

Souichirou Kurokawa

There is provided a printed circuit board in which an amount of molten solder adhering over electrodes adjacent to each other is increased in flow soldering. The printed circuit board according to the present invention includes: a first insulating substrate () having a mounting hole () that penetrates through the first insulating substrate () from a first surface () to a second surface (); a second insulating substrate () including a connection portion () that penetrates through the mounting hole () from the first surface () side and protrudes from the second surface (); first electrodes (and) that are provided on the second surface () and are arranged at an edge of the mounting hole (); and second electrodes (and) provided on the connection portion (). The first electrodes (and) and the second electrodes (and) are joined by solder. The printed circuit board further includes a coating film () that is disposed at least on a front end side of the connection portion () than a portion where the second electrodes (and) are joined to the first electrodes (and) by the solder.

Printed circuit board

A printed circuit board includes: a first insulating substrate having a mounting hole that penetrates through the first insulating substrate from a first surface to a second surface; a second insulating substrate including a connection portion; a first electrode provided on the second surface and disposed at an edge of the mounting hole; a second electrode provided on the connection portion and joined to the first electrode; and an electronic component provided on the second surface. A center of mass of the second insulating substrate is disposed on the first surface of the first insulating substrate. A center of mass of the electronic component is disposed on the second surface of the first insulating substrate. The electronic component has a weight equivalent to a weight of the second insulating substrate.

Growing community of inventors

Tokyo, Japan

Yoshiko Fujima