Asahi Kasei Chemicals Corporation

Asahi Kasei Kabushiki Kaisha

Yoshikimi Kondo

Hiroshi Uchida

Kazuhiro Daikai

Yoshifumi Araki

Kazunori Terada

Shinji Ieda

Jun Mikami

Koichi Nagase

Takayuki Wakita

Kimiaki Kawatani

Hisho Yamada

Tomoyo Okumura

The present invention provides a polyamide composition containing 50 to 99 parts by mass of an aliphatic polyamide (1A) formed from a diamine and a dicarboxylic acid, and 1 to 50 parts by mass of a semi-aromatic polyamide (1B) containing a dicarboxylic acid unit that includes at least 75 mol % of isophthalic acid and a diamine unit that includes at least 50 mol % of a diamine of 4 to 10 carbon atoms, wherein the tan &#x3b4; peak temperature of the polyamide composition is at least 90&#xb0; C., and the weight average molecular weight Mw of the polyamide composition satisfies 15,000&#x2264;Mw&#x2264;35,000. The invention also provides a molded article or the like formed using the polyamide composition.

Polyamide composition and molded article

Provided is a microcapsule-based hardener for an epoxy resin, which have a core (C) formed using a hardener (H) for the epoxy resin as a starting material and a shell (S) for covering the core (C) therewith. Since it is characterized in that the hardener (H) for the epoxy resin has an average particle size exceeding 0.3 &#x3bc;m and not greater than 12 &#x3bc;m; a content of a small-particle-size hardener for epoxy resin defined to have a particle size 0.5 time or less of the average particle size of the hardener (H) for the epoxy resin is from 0.1 to 15%; and the shell (S) has, on the surface thereof, a binding group (x) capable of absorbing infrared rays having a wave number of from 1630 to 1680 cm, a binding group (y) capable of absorbing infrared rays having a wave number of from 1680 to 1725 cm, and a binding group (z) capable of absorbing infrared rays having a wave number of from 1730 to 1755 cm, it is excellent in storage stability and at the same time, in reaction rapidity.

Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good

A microencapsulated latent hardener for epoxy resins which comprises cores (C) and shells (S) with which the cores are covered, characterized in that the cores (C) are ones formed from, as a starking material, particles of an epoxy resin hardener (H) comprising an amine adduct (A) and a low-molecular amine compound (B) as major ingredients and that the shells (S) have on the surface thereof connecting groups (x), (y), and (z) which absorb infrared. Also provided is an epoxy resin composition containing the hardener.

High-stability microencapsulated hardened for epoxy resin and epoxy resin composition

Growing community of inventors

Tokyo, Japan

Yoshikimi Kondo