Sharp Kabushiki Kaisha Corporation

Other

Sharp Corporation

Hitachi Co., Ltd

Yoshiki Sota

Hiroyuki Juso

Yasuki Fukui

Kazuo Tamaki

Atsuya Narai

Yuji Matsune

Masami Yusa

Fumio Inoue

Shinji Yamaguchi

Hidehiro Nakamura

Yoshiaki Tsubomatsu

Masayuki Ohta

Yorio Iwasaki

Masaki Tatsumi

Toshio Yamazaki

Koji Miyata

Shigeki Ichimura

Kazumasa Aoki

Hisashige Nishida

Yasuhiko Awano

Tomoshi Kimura

Shin Itoh

Masamichi Harada

Shin Ito

Yasuhisa Yamaji

Kazuaki Tatsumi

Tomoyo Maruyama

Yoshifumi Inada

Pkg resin crack is suppressed after dicing. A light emitting devicewhere a light emitting devicethat emits light is mounted on a lead frameand that uses a resin cavity molding packagehaving an integrally molded lead framesconstituting electrodes that correspond to the light emitting elementand resin, wherein roundness is given to a part or all of a cutting plane corner part of a retention section (hanger lead) that become a cause of crack generation due to the retention sections (hanger leads) of the lead frames giving stress concentration to resin at the time of cutting by a blade

Light emitting device, lead frame and resin cavity molding package

Improves light extraction efficiency. A light emitting deviceusing a white resin molding packageintegrally molded with lead framesconstituting an electrode corresponding to one or a plurality of light emitting elementand white resin, wherein an area in a plane view of a white resin surface on a reflective surface that is level with amounting surface of the light emitting elementis configured to be larger than total area in a plane view occupied by surfaces of the lead framesand the light emitting element. Further, a step section is formed on the surfaces of lead frames, white resin is filled in the step section, and the area of white resin surface on a reflective surface where the light emitting elementis mounted is increased.

Light-emitting device with reflective resin

Light emitting device

A semiconductor apparatus according to the present invention with a semiconductor element implemented on an insulated substrate comprises: a substrate front surface electrode formed on a front surface side of the insulated substrate and connected with an element electrode of the semiconductor element; a substrate back surface electrode formed on a back surface side of the insulated substrate and electrically connected with the substrate front surface electrode; and a plurality of connection electrodes, extending in a thickness direction of the insulated substrate from one side to the other side of a front surface and a back surface thereof, for electrically connecting the substrate front surface electrode with the substrate back surface electrode, where the substrate front surface electrode or the substrate back surface electrode is formed to have a plane pattern separated for each of the plurality of connection electrodes.

Semiconductor apparatus, inspection method thereof and electric device

A wiring board () of the present invention includes: a through hole (), provided in a semiconductor chip mounted region (), penetrating the wiring board (); and a groove pattern (), provided on a solder resist () formed on the semiconductor chip mounted region (), leading to the through hole (). The foregoing configuration makes it possible to guide, via the groove pattern () to the through hole (), moisture that collects in the semiconductor chip mounted region () and therefore to effectively discharge the moisture from the semiconductor chip mounted region (). Thus, a semiconductor device () that employs the wiring board () does not suffer from vaporization and expansion, inside of it, due to heat that is applied at the time of manufacturing the semiconductor device () and at the time of mounting the semiconductor device () on a mount substrate. It is therefore possible to reduce expansion of the semiconductor device.

Wiring board, semiconductor device and method for manufacturing semiconductor device

A wiring board of the present invention includes a dummy wiring in a semiconductor-chip mount area on which a semiconductor chip is to be mounted. The dummy wiring is arranged in a manner such that all wiring-lines included in the dummy wiring each have a free end within the semiconductor-chip mount area. This prevents a defect due to vaporization and expansion of moisture inside a semiconductor apparatus, with a simple structure and without raising costs.

Wiring board and semiconductor apparatus

In a semiconductor device in which a semiconductor chip is stacked on a substrate, an interposer chip having wirings is provided under the semiconductor chip. A bonding pad of the semiconductor chip is electrically connected to a bonding terminal provided on the substrate via the interposer chip by wire bonding. The interposer chip prevents a semiconductor element formed in the semiconductor chip from deteriorating in terms of an electric property and from being physically damaged. Further, the wire bonding strength does not drop. Moreover, it is possible to form a fine wiring pitch for relaying a wire-bonding wire.

Semiconductor device

A first semiconductor chip is produced by affixing a thermo-compression sheet to the back surface of a wafer having a circuit formed on its front surface. The first semiconductor chip is mounted on a circuit board including an insulating substrate and a wiring layer provided on the insulating substrate so that the back surface of the first semiconductor chip faces the circuit board. A second semiconductor chip produced in the same manner as the first semiconductor chip is mounted on the first semiconductor chip with its back surface facing the first semiconductor chip. Each of the first and second semiconductor chips is wire-bonded to the wiring layer with a wire. The first and second semiconductor chips and the wire are sealed with a sealing resin. The wiring layer is connected to external connection terminals through via holes provided in the insulating substrate.

Semiconductor device and method of manufacturing the same

A semiconductor package substrate of the present invention includes a first wiring substrate which has an opening section for mounting a semiconductor chip, and a second wiring substrate which has a second wire bonding terminal sections and second connecting terminal land sections, and through holes so that the second connecting terminal land sections on the first surface communicate to the second surface which is opposite to the first surface. The second surface of the first wiring substrate and the first surface of the second wiring substrate are mated in the state where the second wire bonding terminal sections are exposed. The semiconductor package substrate is suitable for a stacked semiconductor package, and capable of dense mounting. Also, it provides a stable and ensured mouting, thereby increasing the yield of the stacked semiconductor package.

Semiconductor package substrate, semiconductor package

A semiconductor device includes a wiring substrate which includes a wiring pattern provided per each wiring with a land covering an external terminal mounting perforation for mounting an external terminal, said land being provided on a side of the wiring pattern on which side a semiconductor chip is mounted, wherein a plurality of second pads for electrically connecting the wiring and the semiconductor chip by wire bonding are provided per each wiring, and at least one of the second pads is provided between lands.

Wiring substance and semiconductor

In a substrate for a semiconductor device including a plurality of first through holes and a wiring pattern having a conductive land portion covering the entire surface of the opening of each of the first through holes on one surface, a second through hole is formed in a region other than the forming region of the wiring pattern, and the shape of opening of said second through hole is not a circular shape and has a corner portion.

Semiconductor device and substrate for semiconductor device

A resin overmolded semiconductor device includes an insulative substrate having a plurality of first through-holes, interconnection patterns provided on a chip-side surface of the insulative substrate, external connection terminals provided on the opposite surface of the insulative substrate, a semiconductor chip mounted on the chip-side surface, and a sealing portion. The insulative substrate is further formed with a plurality of second through-holes each having one end which is open on the opposite surface, and has second lands which cover the other ends of the second through-holes on the chip-side surface.

Resin overmolded type semiconductor device

Growing community of inventors

Nara, Japan

Yoshiki Sota