Daicel-Evonik Ltd.

Polyplastics-Evonik Corporation

Evonik Degussa Gmbh

Yoshiki Nakaie

Sylvia Monsheimer

Mitsuteru Mutsuda

Hiroaki Arita

Takayuki Uno

Hajime Komada

Hideki Matsui

Daisuke Fujiki

Toshihiko Fujinaka

Taiji Yamabe

Prepared is a laminate including: a first layer formed of a first resin composition containing a first resin; and a second layer formed of a second resin composition containing a second resin, the first layer and the second layer being in contact with each other and integrated. The first resin includes an alicyclic polyamide resin having 20 mmol/kg or greater of amino groups, and the second resin includes an acid-modified (meth)acrylic resin. The second resin may have 100 mmol/kg or greater of carboxyl groups. The acid-modified (meth)acrylic resin may be an acid-modified polymethylmethacrylate resin. An average thickness of the first layer may be 0.15 times or more of an average thickness of the second layer. The average thickness of the first layer may be 200 μm or greater. When a weight is dropped onto the second layer side, the laminate may have a DuPont impact strength of 500 N/inch or greater. The laminate has excellent transparency, lightness, light resistance, and impact resistance.

Laminate, method for producing same, and use of same

Provided is a method for producing resin particles by melt-kneading with a non-water-soluble resin in a wide range of melt-kneading temperature according to the melting point or glass transition temperature of the resin. This production method includes melt-kneading a water-soluble matrix, containing a modified polyvinyl alcohol-based resin, and a non-water-soluble resin to form a pre-molded article in which the non-water-soluble resin is dispersed in particulate; and bringing the pre-molded article into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).

Method for producing resin particles

(A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10&#xb0; C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 &#x3bc;m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150&#xb0; C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100&#xb0; C., or a polyamide resin having a &#x3b3;-type crystal structure or a degree of crystallinity of not more than 50%). The matrix resin (C) may be a thermosetting resin.

Fiber-reinforced resin, process for producing same, and molded article

Polyamide particles including polyamide and having a water absorption rate of 0.5 to 2.5 wt. % are prepared to improve toughness of a cured product of a curable resin. The polyamide may be a semicrystalline polyamide. The polyamide has a glass transition temperature of approximately 100 to 150&#xb0; C. The polyamide may have an alicyclic structure. The polyamide particles of this invention have an average particle size of approximately 5 to 40 &#x3bc;m and a specific surface area determined by the BET method of approximately 0.08 to 12 m/g. The polyamide particles of the present invention may also be spherical and have an average particle size of approximately 15 to 25 &#x3bc;m. Furthermore, the polyamide particles of the present invention may have an exothermic peak in a temperature range between the glass transition temperature and a melting point of the polyamide upon heating the polyamide particles at a rate of 10&#xb0; C./min by differential scanning calorimetry (DSC).

Polyamide particles, production process therefor, resin composition, and molded article

Provided are: a water-soluble matrix whose melt-kneading temperature can be adjusted according to the melting point or glass transition temperature of a resin; a pre-molded article in which resin particles are dispersed in the water-soluble matrix; and a method for producing resin particles. This production method includes melt-kneading a water-soluble matrix containing a modified polyvinyl alcohol-based resin and a water-soluble saccharide at a weight ratio of the former/the latter=from 99/1 to 50/50 and a thermoplastic resin, and bringing the pre-molded article in which the resin particles are dispersed into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).

Water-soluble matrix, pre-molded article containing resin particles, and method for producing resin particles

Disclosed is a method for producing resin particles, which can impart a desired function to the surface of resin particles efficiently and simply. Also disclosed are resin particles produced by the method. The method produces resin particles by melting and mixing an acidic-group-containing thermoplastic resin or elastomer with filler particles and a water-soluble material to give a resin composition containing resin fine particles formed by the thermoplastic resin and the filler particles and dispersed in a matrix including the water-soluble material; and removing the matrix component from the resin composition, to give the resin particles. The resulting resin particles each include a core particle including the acidic-group-containing thermoplastic resin or elastomer, and the filler particles immobilized on the outside of the core particle. The acidic group is preferably carboxyl group or carboxylic anhydride group.

Method for production of resin particle

A film sealant useful for tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The device is covered and sealed by covering at least a region of the device with a film sealant containing a copolyamide-series resin, heat-melting the sealant, and cooling the sealant. The copolyamide-series resin may have a melting point or softening point of 75 to 160&#xb0; C. and may be a crystalline resin. The copolyamide-series resin may be a multiple copolymer or may contain a unit derived from a long-chain component having a Calkylene group (e.g., a Clactam and an aminoCalkanecarboxylic acid). The film sealant may cover one side of the device.

Growing community of inventors

Himeji, Japan

Yoshiki Nakaie