Tokyo Electron Limited

Yoshiki Fukuhara

Atsushi Ando

Tsutomu Hiroki

Kippei Sugita

Kazuyoshi Matsuzaki

Ikuo Sawada

Harunari Hasegawa

Makoto Takahashi

A conveyance device, which conveys wafers in a casing, includes a primary blowing fanthat generates airflow within the casingin a first direction; a discharge openingthat is located at a downstream side of the airflow generated by the primary blowing fan, is interconnected with the interior of the casing, and discharges gases at the interior of the casingoutside of the casing; a basethat is supported by a gate-shaped conveyance armdisposed within the casingand moves within the casingat the upstream side of the discharge openingand at the downstream side of the primary blowing fan; an end effectorthat is located at the baseand that carries wafers; and a blowing fanthat is located at the base and that generates airflow in the first direction.

Conveyance device and substrate processing system

Provided is a film forming apparatus for forming a film on a substrate maintained within a film forming container by supplying a raw material gas to the substrate. The film forming container includes a substrate maintaining unit, a supply mechanism configured to include a supply pipe with supply holes formed thereon to supply a raw material gas to the interior of the film forming container through the supply holes, an exhaust mechanism configured to include an exhaust pipe with exhaust holes formed thereon to exhaust gas from the interior of the film forming container through the exhaust holes, and a controller configured to control the substrate maintaining unit, the supply mechanism, and the exhaust mechanism. The supply holes and the exhaust holes are formed to face each other with the substrate maintained in the substrate maintaining unit interposed therebetween.

Film forming apparatus

Growing community of inventors

Nirasaki, Japan

Yoshiki Fukuhara