Omron Corporation

Yoshiki Fujii

Hiroshi Yamazaki

Akira Nakajima

Toshihiro Moriya

Kiyoshi Murakami

Akira Oshiumi

Yasuaki Nakajima

Toshiyuki Sugiyama

Yujin Fujita

Yasutomo Doi

Taku Minakata

Reference data for automatically inspecting shapes of fillets formed on a substrate are set to an inspection device that illuminates the substrate from specified directions to generate an image. For each type of components mounted to the substrate, a database is prepared, registering sets of reference data corresponding to different fillet shapes in correlation with heights of solder for forming fillets having these shapes. After components to be an object of inspection are identified, specified steps are carried out on each of these components, including the step of obtaining data on the height of solder for forming the fillet related to a land for which a target area for inspection has been set and reading out reference data corresponding to the data obtained from the reference data registered in the database.

Method of setting reference data for inspection of fillets and inspection device using same

A substrate inspection system is formed with an inspection device associated with a reflow process at the end of a series of production processes for substrates, image collectors each associated with a different one of the production processes upstream to the reflow process and an image display device for receiving images from the inspection device and the image collector and displaying the received images. The inspection device inspects a specified number of substrates to obtain measured values and calculates a margin for each component with respect to a specified reference value and transmits to the image collectors and the image display device the component code of the component with a small margin value. The image collectors save the image corresponding to the component code from the inspection device. The image display device receives images of the component corresponding to the component code from the inspection device and the image collectors and display images of the same component and the same substrate at each process.

Substrate inspection system including a visual inspection device for inspection by image processing

After a CAD data and a parts library are combined to produce an inspection data, the set data for the inspection window is automatically corrected using the image of a bare board for a board to be inspected. In this correcting process, an inspection window based on the aforementioned inspection data is set on a bare board image, and then an image in the inspection window Wmaking up a reference for setting other windows is binarized, and landson this binary image are detected. Further, on the basis of the detection result, the set position and size of land windows Wfor solder inspection are corrected, after which the set positions of other inspection windows Wto Ware corrected.

Inspection data producing method and board inspection apparatus using the method

When a component is replaced or replenished in a predetermined feeder, mountersA andB refer to mount data in accordance with the feeder number for the feeder and read out the mounting position of the replaced or replenished component. The mounting position data is transmitted to a substrate inspecting apparatustogether with the substrate identification code of a substrate first processed after reel replacement. When the substrate corresponding to the substrate identification code is supplied, the substrate inspecting apparatusrefers to substrate inspection data in accordance with the mounting position data, specifies a component to be inspected, and executes the mounting error inspection according to character-string recognition for the specified component. When a mounting error is detected in this inspection, the substrate inspecting apparatustransmits no-good determination to the mountersA andB receiving information.

Mounting-error inspecting method and substrate inspecting apparatus using the method

A circuit board with lead-free solder is inspected by using light sources with different colors at different angles to obtain an image having a plurality of color components. For each pixel within an area in the obtained image, the brightness of a white component generated by mixing all of the color components is extracted. The brightness of each of the color components of each pixel is reduced by an amount corresponding to the extracted brightness of the white component and is adjusted such that the brightest of the color components becomes more strongly emphasized compared to the others, than the brightness before the brightness-reducing process was carried out and the loss in total brightness caused by the brightness-reducing process is restored. The image with restored brightness is displayed and the surface condition of the solder is judged on the basis of the distributions of the color components of this image.

Method of inspecting curved surface and device for inspecting printed circuit board

In a substrate inspecting apparatus comprising a projecting section () in which light sources (), () and () are provided for emitting colored lights of R, G and B in directions having different elevation angles, one or two color components which is/are greater than the mean value of the intensities of color components is/are extracted for an inspecting region including a soldered portion. Inclined surfaces adapted to the light sources (), () and () are converted into monochromatic shaded images by the extraction processing. A boundary position between the inclined surfaces adapted to the light sources () and () are converted into one shaded image having a mixed color of red and green and the boundary position between the inclined surfaces adapted to the light sources () and () is converted into a different shaded image.

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Kyoto, Japan

Yoshiki Fujii