Shinko Electric Industries Co., Ltd.

Yoshiki Akiyama

Hiroshi Taneda

Noriyoshi Shimizu

Rie Mizutani

Masaya Takizawa

Kei Imafuji

Kensuke Uchida

A wiring board includes an interconnect structure including a plurality of interconnect layers, and a plurality of insulating layers having a photosensitive resin as a main component thereof, and an encapsulating resin layer having a non-photosensitive thermosetting resin as a main component thereof, laminated on an uppermost insulating layer of the plurality of insulating layers. An uppermost interconnect layer of the plurality of interconnect layers includes a pad protruding from the uppermost insulating layer. The encapsulating resin layer exposes an upper surface of the pad, and covers at least a portion of a side surface of the pad, and at least a portion of side surfaces of the plurality of insulating layers. The pad is configured to receive a semiconductor chip to be mounted thereon.

Wiring board and semiconductor device each having non-photosensitive thermosetting encapsulating layer over photosensitive resin layer of interconnect structure

A wiring substrate includes a bendable portion including one or more wiring layers and insulation layers that are alternately stacked. The insulation layers of the bendable portion include a first insulation layer and a second insulation layer. The first insulation layer is located at an inner bent position of the bendable portion when the bendable portion is bent. The second insulation layer is located at an outer bent position of the bendable portion relative to the first insulation layer when the bendable portion is bent. The first insulation layer has a higher elastic modulus than the second insulation layer.

Wiring substrate and semiconductor device

An interconnect substrate includes a core layer including a resin layer mainly composed of a non-photosensitive thermosetting resin and a through interconnect extending through the resin layer, the core layer having no reinforcement member contained therein, a first interconnect structure laminated on a first side of the core layer and including first interconnect layers and first insulating layers mainly composed of a photosensitive resin, and a second interconnect structure laminated on a second side of the core layer and including second interconnect layers and a single second insulating layer mainly composed of a photosensitive resin, wherein the first interconnect layers are electrically connected to the second interconnect layers via the through interconnect, wherein the core layer has greater rigidity than the first interconnect structure and the second interconnect structure, and wherein a thickness of the second interconnect structure is greater than a thickness of each of the first insulating layer.

Interconnect substrate

A wiring board includes an insulating layer, a thin film capacitor laminated on the insulating layer, an interconnect layer electrically connected to the thin film capacitor, and an encapsulating resin layer laminated on the thin film capacitor. The interconnect layer includes a pad protruding from the thin film capacitor. The encapsulating resin layer is a mold resin having a non-photosensitive thermosetting resin as a main component thereof. The encapsulating resin layer exposes a top surface of the pad, and covers at least a portion of a side surface of the pad.

Wiring board

A wiring board includes a first interconnect structure including a first interconnect layer, and a first insulating layer including a non-photosensitive thermosetting resin as a main component thereof, a second interconnect structure including second interconnect layers, and second insulating layers including a photosensitive resin as a main component thereof, and laminated on the first interconnect structure, and an encapsulating resin layer including a non-photosensitive thermosetting resin as a main component thereof, and laminated on an uppermost second insulating layer. An uppermost second interconnect layer includes a pad protruding from the uppermost second insulating layer. The encapsulating resin layer exposes a top surface of the pad, and covers at least a portion of a side surface of the pad. Thermal expansion coefficients of the first insulating layer and the encapsulating resin layer are lower than that of the second insulating layers.

Growing community of inventors

Nagano, Japan

Yoshiki Akiyama