Ibiden Company Limited

Yoshikazu Ukai

Kiyotaka Tsukada

Hiroyuki Kobayashi

Mitsuhiro Kondo

Masaru Takada

Hisashi Minoura

Kenji Chihara

Yoshihiro Kodera

Yoshihide Tohyama

Yasuyoshi Okuda

A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the insulating layer toward the innerlayer conductor circuit. A central portion of the innerlayer conductor circuit contains a previously formed opening hole located at the bottom of the blind via-hole. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits and the blind via-holes.

Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit

In the production of a printed wiring board comprising innerlayer conductor circuits arranged among insulating layers and blind via-holes formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole is previously formed in a central portion of the innerlayer conductor circuit located at the bottom of the blind via-hole , and laser beams are irradiated from the outermost surface of the insulating layer to form the blind via-holes . Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits and the blind via-holes

Printed wiring board having throughole and annular lands

This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal.

Soldering member for printed wiring boards

Growing community of inventors

Ogaki, Japan

Yoshikazu Ukai