Nichia Corporation

Yoshikazu Takeuchi

Ryo Suzuki

Hirokazu Sasa

Tadao Hayashi

Toshiaki Moriwaki

Tomoya Tsukioka

Takahiro Tani

Atsushi Takeichi

A method for manufacturing a light emitting device includes preparing a light emitting element that includes a light transmissive substrate comprising a first main surface, a second main surface, and a side surface having a light transmitting part and a light absorbing part whose optical transmissivity is lower than that of the light transmitting part, and a semiconductor laminate that is provided to the first main surface of the light transmissive substrate, joining the light emitting element to an upper surface of a base body such that the base body is opposite to the side where the semiconductor laminate is provided, providing a support member that covers the side surface of the light emitting element and part of the base body, and removing the light absorbing part by thinning the light transmissive substrate from the second main surface side.

Method for manufacturing light emitting device

A method for manufacturing a light emitting device has: preparing a base body which comprises a pair of connection terminals; preparing a light emitting element which includes a substrate, a semiconductor laminate that is laminated on the substrate, and a pair of electrodes formed on the surface of the semiconductor laminate; joining the electrodes of the light emitting element to the connection terminals of the base body; covering the light emitting element with a sealing member; and removing at least a part of the sealing member and a part of the substrate of the light emitting element from the opposite side from the base body so that an upper surface of the sealing member is lower than an upper surface of the substrate of the light emitting element.

A method of manufacturing a light-emitting device includes flattening top portions of solder bumps disposed on a wiring substrate, disposing a light-emitting element on the solder bumps whose top portions are flattened, and heating the solder bumps to be melt and to be fused so as to provide an adhesive with which the light-emitting element is secured on the wiring substrate.

Method of manufacturing light-emitting device and wiring substrate for light-emitting element

A light emitting device comprises a rectangular element mounted upon a mounting substrate via a heat-melted connecting material, wherein second substrate electrodes are formed conforming to the recesses of a first substrate electrode and a portion of the outer periphery of the first and second substrate electrodes is provided with first extended sections that extend farther outward than the outer periphery of the aforementioned element. The aforementioned first extended sections are formed in at least one or more locations per one side of the outer periphery of the aforementioned rectangular element; the aforementioned first substrate electrode is provided with second extended sections that are formed on at least one of both ends of the aforementioned recesses flanking the first extended sections of the aforementioned second substrate electrodes; and the aforementioned second extended sections extend farther outward than the outer periphery of the aforementioned element.

Growing community of inventors

Komatsushima, Japan

Yoshikazu Takeuchi