Toyota Jidosha Kabushiki Kaisha

Japan Science and Technology Agency

Tohoku University

Tanaka Kikinzoku Kogyo K.k.

Yoshikazu Takaku

Kiyohito Ishida

Toshihiro Omori

Ikuo Ohnuma

Ryosuke Kainuma

Yasushi Yamada

Takashi Atsumi

Yuji Yagi

Ikuo Nakagawa

Takehito Hagisawa

Mikio Shirai

Kiyogito Ishida

A hydrogen gas generating member includes a metal alloy having dispersed aluminum. The metal alloy includes an Al&#x2014;X alloy, where X is Sn: 10.1 to 99.5% by mass, Bi: 30.1 to 99.5% by mass, In: 10.1 to 99.5% by mass, Sn +Bi: 20.1 to 99.5% by mass, Sn +In: to 10 to 99.5% by mass, Bi+In: 20.1 to 99.5% by mass, or Sn+Bi+In: 20 to 99.5% by mass. Hydrogen gas is generated by bringing the hydrogen gas generating member into contact with water.

Hydrogen gas generating member and hydrogen gas producing method therefor

The present invention is a heat-resistant material comprising a Rh-based alloy, wherein the Rh-based alloy is a high heat-resistant and high strength alloy comprising a Rh-based alloy where Al and W as essential additive elements are added to Rh (0.2 to 15.0 mass % of Al, 15.0 to 45.0 mass % of W and Rh as the remainder), and a &#x3b3;' phase (Rh(Al, W)) having an L1structure is dispersed as a strengthening phase in a matrix. The Rh-based alloy of the present invention can be further improved in workability and high temperature oxidation characteristics by optionally adding B, C, Mg, Ca, Y, La or misch metals, Ni, Co, Cr, Fe, Mo, Ti, Nb, Ta, V, Zr, Hf, Ir, Re, Pd, Pt or Ru as an additive element. The Rh-based alloy of the present invention is a heat-resistant material having excellent high-temperature-resistant characteristics and a good balance of factors such as weight.

Highly heat-resistant and high-strength Rh-based alloy and method for manufacturing the same

A zinc based solder materialof the present invention is prepared by providing on the surface of a zinc based material, from which an oxide filmhas been removed or at which an oxide filmdoes not exist, with a coating layercontaining primarily a metal whose oxide is more easily reducible than the oxide film. In a joined body and a power semiconductor module of the present invention, the zinc based solder materialis used in the joining portion, and after joining, the coating layerdoes not exist.

Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same

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Sendai, Japan

Yoshikazu Takaku