Jfe Steel Corporation

Disco Corporation

Nippon Kayaku Kabushiki Kaisha

Nec Corporation

Konoshima Chemical Co., Ltd.

Oki Electric Industry Co., Ltd.

Nkk Corporation

Resonac Corporation

Furukawa-sky Aluminum Corporation

Uacj Corporation

Yoshikazu Suzuki

Yoshimasa Himei

Yoichi Makimizu

Gentaro Takeda

Hideyuki Takahashi

Hiroshi Hasegawa

Yoshimasa Funakawa

Noriaki Kohsaka

Hideki Yagi

Yoshitsugu Suzuki

Hikaru Kouta

Michitaka Sakurai

Takagimi Yanagitani

Munehiro Ishioka

Akira Gamou

Yoichi Miyakawa

Masaki Tsunekane

Katsuji Mukaihara

Shuetsu Kudo

Kazuhisa Kabeya

Koichi Ishida

Makoto Saito

Takashi Ueno

Akihiro Nakamura

Yoshitaka Sato

Toshio Ishii

Hiroshi Sato

Yutaka Yanagawa

Hiromi Yoshitomi

Yoshiyuki Oya

Takeo Kikuchi

Masaru Miyake

Junji Ninomiya

Arihiro Tomura

Shota Okade

Daisuke Akita

Nobuyuki Kakimoto

Junko Odanaka

Shunsuke Kuroiwa

Sakiko Maruyama

Kyohei Ishida

Hayato Sawamoto

Daisuke Tanemura

Shuji Nomoto

Tomoharu Kihara

Yuji Takase

Fumio Fujita

Akihito Gotou

There is provided a grinding method that is applied when a workpiece having a first surface and a second surface is to be ground from the second surface. The grinding method includes a first grinding step of causing first grindstones to come into contact with the workpiece to grind the workpiece and thereby form on the workpiece a circular plate-shaped first thin plate portion and an annular first thick plate portion surrounding the first thin plate portion, and a second grinding step of causing second grindstones to come into contact with the first thick plate portion and the first thin plate portion to grind the workpiece and thereby form on the workpiece a thin circular plate-shaped second thin plate portion that has a larger diameter than the first thin plate portion and an annular second thick plate portion surrounding the second thin plate portion.

Grinding method for circular plate-shaped workpiece

A dressing ring includes a ring-shaped dressing member for dressing a processing stone. Preferably, the dressing member has an opening in which a workpiece is arranged when the workpiece is ground. Also preferably, the dressing ring further includes a ring-shaped support plate having an upper surface on which the dressing member is fixed. In addition, a grinding method of the workpiece includes the steps of holding the ring-shaped dressing member on a holding surface of a chuck table, holding the workpiece in the opening of the dressing member such that a back surface of the workpiece is located higher than the upper surface of the dressing member, grinding the workpiece by grinding stones of a grinding wheel, and dressing the grinding stones with the dressing member on the holding surface.

Dressing ring

A grinding method includes a first grinding step of executing grinding feed of a rough grinding unit and grinding the workpiece to a predetermined thickness while supplying grinding water with a first grinding water amount that allows suppression of wear of grinding abrasive stones and a second grinding step of, after executing the first grinding step, promoting dressing of the grinding abrasive stones to prepare for processing of the next workpiece through executing grinding feed of the rough grinding unit and grinding the workpiece to the finished thickness while supplying the grinding water with a second grinding water amount that increases wear of the grinding abrasive stones and promotes self-sharpening through reduction relative to the first grinding water amount.

Grinding method of workpiece

The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.

Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring board

There is provided a processing method of grinding a workpiece. The processing method includes a holding step of holding the workpiece on a side of its front surface on a chuck table, a coarse grinding step of grinding the workpiece on a side of its back surface with first grinding stones until the workpiece has a predetermined thickness, an auxiliary grinding step of grinding the workpiece on the side of its back surface with the first grinding stones such that an unground region remains at an outer peripheral portion of the workpiece, an unground region grinding step of grinding the unground region with second grinding stones having an average abrasive grain size smaller than that of the first grinding stones, and a finish grinding step of grinding the workpiece on the side of its back surface with the second grinding stones until the workpiece has a predetermined finish thickness.

Processing method of workpiece

A workpiece surface is polished by a polishing pad surface by keeping a point on an outer circumferential edge of the workpiece surface at predetermined coordinates, i.e., first coordinates, in a plane parallel to the workpiece surface but out of contact with the polishing pad surface, and keeping a point on the outer circumferential edge of the polishing pad surface at other coordinates, i.e., third coordinates, in the coordinate plane in contact with an outer circumferential edge of the workpiece surface. In this manner, the workpiece surface is polished in its entirety, and a region of the polishing pad surface in the vicinity of the outer circumferential edge thereof can be worn to the same degree as a region that is located inwardly of the above region. The polishing pad surface is thus prevented from developing a stepped profile due to the polishing of the workpiece surface.

Processing method

A method of grinding a workpiece includes a first grinding step of adjusting the relative tilt of a chuck table and a grinding wheel to a first state and bringing grindstones into abrasive contact with the workpiece to grind the workpiece, and a second grinding step of adjusting the relative tilt of the chuck table and the grinding wheel to a second state that is different from the first state and bringing the grindstones into abrasive contact with the workpiece to grind the workpiece. In the second grinding step, the workpiece is ground under a condition for causing the workpiece to have a smaller surface roughness than that in the first grinding step.

Method of grinding workpiece

A workpiece has a device area and a peripheral area surrounding the device area on a front surface side thereof. A workpiece grinding method includes a groove forming step of performing grinding feed of a grinding unit while a spindle is rotated, and grinding a predetermined area on a back surface side of the workpiece, the predetermined area corresponding to the device area, in a state in which a chuck table holding the workpiece is not rotated, thereby forming a groove on the back surface side, a groove removing step of starting rotation of the chuck table while the spindle is kept rotating, thereby grinding side walls of the groove and removing the groove, and a recess forming step of performing grinding feed of the grinding unit while the spindle and the chuck table are rotated, thereby grinding the predetermined area and forming a recess and a ring-shaped reinforcement part.

Workpiece grinding method

A continuous hot-dip galvanizing apparatus has a vertical annealing furnace, one or more hearth rolls, a hot-dip galvanizing apparatus, an alloying line, and humidified gas supply ports. When the steel sheet having a Si content of 0.2 mass % or more is conveyed inside the annealing furnace, the humidified gas supply ports positioned in a latter part of the soaking zone supply the humidified gas to the soaking zone and the at least one dry gas supply port supplies the dry gas to the soaking zone. When the steel sheet having a Si content of less than 0.2 mass % is conveyed inside the annealing furnace, the plurality of the humidified gas supply ports do not supply the humidified gas to the soaking zone and the at least one dry gas supply port supplies the dry gas to the soaking zone.

Continuous hot dip galvanizing apparatus

A workpiece grinding method includes a groove formation step, a groove removal step, and a full surface grinding step. In the groove formation step, the workpiece is ground by performing grinding feed of a grinding unit while rotating a spindle without rotation of a chuck table, so that an arcuate groove is formed with a depth not reaching a finish thickness on a side of a back surface of the workpiece. In the groove removal step, rotation of the chuck table is started with the spindle kept rotating, so that the groove is ground at side walls thereof and is removed from the workpiece. In the full surface grinding step, grinding feed of the grinding unit is performed while the spindle and chuck table are rotated, so that the workpiece is ground in an entirety thereof on the side of the back surface until the workpiece has the finish thickness.

Provided is a method for manufacturing a high-strength galvanized steel sheet. Heating in a first half of oxidizing treatment is performed at a temperature of 400&#xb0; C. to 750&#xb0; C. in an atmosphere having a particular Oconcentration and a particular HO concentration, and heating in a second half of the oxidizing treatment is performed at a temperature of 600&#xb0; C. to 850&#xb0; C. in an atmosphere having a particular Oconcentration and a particular HO concentration. Subsequently, heating in a heating zone for reduction annealing is performed to a temperature of 650&#xb0; C. to 900&#xb0; C. at a particular heating rate in an atmosphere having a particular Hconcentration and a particular HO concentration with the balance being Nand inevitable impurities, and soaking in a soaking zone for the reduction annealing is performed in an atmosphere having a particular Hconcentration and a particular HO concentration with the balance being Nand inevitable impurities.

Method for manufacturing high-strength galvanized steel sheet

Provided is a method for producing a galvannealed steel sheet. When the steel sheet passing through the soaking zone is a type of steel containing 0.2 mass % or more of Si, both dry gas and humidified gas are supplied to the soaking zone, where the humidified gas is supplied only from the humidified gas supply port positioned in a latter part of the soaking zone among a plurality of humidified gas supply ports, where the latter part of the soaking zone is determined considering a sheet passing speed V and a target temperature T on the exit side of the soaking zone.

Method for producing galvannealed steel sheet, and continuous hot dip galvanizing apparatus

A high-strength galvanized steel sheet having improved post-work impact resistance, a method for producing the high-strength galvanized steel sheet, and a high-strength member produced using the steel sheet. The high-strength galvanized steel sheet includes a steel sheet having a microstructure including ferrite and carbide-free bainite, martensite and carbide-containing bainite, and retained austenite, the total area fraction of ferrite and carbide-free bainite being 0% to 55%, the total area fraction of martensite and carbide-containing bainite being 45% to 100%, and the area fraction of retained austenite being 0% to 5%. Additionally, a galvanizing layer is disposed on the steel sheet. The density of gaps that cut across the entire thickness of the galvanizing layer in a cross section of the galvanizing layer, which is taken in the thickness direction so as to be perpendicular to the rolling direction, is 10 gaps/mm or more.

High-strength galvanized steel sheet, high-strength member, and method for producing high-strength galvanized steel sheet

A grinding method includes an oblique grinding step of rotating a grinding wheel about the central axis of a second shaft, tilting the second shaft to a first shaft of a rotatable chuck table such that the bottom of a first portion of the grinding wheel that is positioned above an outer circumferential portion of the chuck table is higher than the bottom of a second portion of the grinding wheel that is positioned above a central portion of the chuck table, and then moving the grinding wheel and the chuck table relatively closer to each other along a direction parallel to the first shaft, thereby forming a disk-shaped recess in the reverse side of the workpiece, and a tilt changing and grinding step of grinding the reverse side of the workpiece while gradually changing a tilt of the second shaft to orient parallel to the first shaft.

Grinding method

Provided are a steel sheet having a tensile strength of 950 MPa or more and good toughness and a method for manufacturing the same. The steel sheet has a specific composition and a metallographic structure containing: a ferrite area fraction of 30% or less (including 0%), a tempered martensite area fraction of 70% or more (including 100%), and a retained austenite area fraction of 4.5% or less (including 0%), wherein the average aspect ratio of an iron based carbide, precipitated in tempered martensite grains, having a grain size in the largest 10% is 3.5 or more.

Steel sheet and method for manufacturing the same

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Tokyo, Japan

Yoshikazu Suzuki