C.uyemura Co., Ltd.

Other

Yoshikazu Saijo

Hisamitsu Yamamoto

Masayuki Utsumi

Masayuki Kiso

Tomoji Okuda

Tohru Kamitamari

Nobuhiko Naka

Masanobu Izaki

Hiroshi Hatase

Takuya Komeda

Yoshinori Nakanishi

Katsuhisa Tanabe

Yukinori Oda

Takahiro Ishizaki

Seigo Kurosaka

Takuya Okamachi

Tetsuji Ishida

Yutaka Nishinaka

Hiroki Omura

A present invention provides a method for manufacturing a printed wiring board having excellent plating adhesion to a resin substrate having low surface roughness such as having surface roughness Ra of 0.2 &#x3bc;m or less, having excellent treating solution stability, and having high penetrability into the resin substrate. The method for manufacturing a resin substrate includes a step 1A or a step 1B; and a step 2 after the step 1A or the step 1B; and the steps are conducted before conducting electroless plating.

Method for producing a printed wiring board

A novel pretreating liquid for electroless plating which is used simultaneously with reduction treatment after roughening treatment of a filler-containing insulating resin substrate. A pretreating liquid for electroless plating is used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced. The pretreating liquid comprises: a reducing agent; and at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OCH)n-OH (m=an integer of 1 to 4, n=an integer of 1 to 4) and propylene-based glycol ether represented by CxH(2x+1)-(OCH)y-OH (x=an integer of 1 to 4, y= an integer of 1 to 3).

Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board

An ultrasonic treatment apparatus including: an ultrasonic bath for performing an ultrasonic treatment on a treatment target object; a first ultrasonic vibrator provided on the front surface side of the treatment target object; and a second ultrasonic vibrator provided on the back surface side of the treatment target object; wherein the first ultrasonic vibrator does not face the second ultrasonic vibrator.

Ultrasonic treatment apparatus

The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.

Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same

A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: CH&#x2014;(OCH)&#x2014;OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: CH&#x2014;(OCH)&#x2014;OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.

The regeneration unit includes a tubular portion having the inner circumferential surface functioning as an anode, and a cathode provided inside the tubular portion and extending along the extension direction of the tubular portion in a state of separation from the inner circumferential surface. The treatment liquid used for desmearing treatment is fed through a gap between the inner circumferential surface of the tubular portion and the cathode. A feed-side conduit is connected by a downstream end portion thereof to the tubular portion and guides the treatment liquid discharged from a desmearing treatment tank into a regeneration unit. A return-side conduit is connected by an upstream end portion thereof to the tubular portion and guides the treatment liquid discharged from the regeneration unit into the desmearing treatment tank.

Electrolytic regeneration device

An anode pipe includes a main pipe portion and a secondary pipe portion. The anode pipe has an inner circumferential surface that functions as an anode. The main pipe portion has a first connection end portion and a second connection end portion. The main pipe portion forms a flow channel for a treatment liquid that continues from the first connection end portion to the second connection end portion. The secondary pipe portion extends in a tubular fashion from the intermediate section of the main pipe portion. The interior of the secondary pipe portion communicates with the flow channel inside the main pipe portion. The cathode is disposed at a distance from the inner circumferential surface of the anode pipe. The cathode extends from a cathode attachment end portion toward the main pipe portion inside the secondary pipe portion.

Electrolytic regeneration unit and electrolytic regeneration apparatus using same

An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, an aldehyde compound, and an amine compound represented by R&#x2014;NH&#x2014;CH&#x2014;NH&#x2014;Ror (CH&#x2014;NH&#x2014;CH&#x2014;NH&#x2014;CH)&#x2014;R(wherein Rto Rrepresent &#x2014;OH, &#x2014;CH, &#x2014;CHOH, &#x2014;CHOH, &#x2014;CHN(CH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHN(CHOH), &#x2014;CHN(CHOH), &#x2014;CHN(CHOH)or &#x2014;CHN(CHOH), and n is an integer of 1 to 4). The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.

Electroless gold plating bath, electroless gold plating method and electronic parts

An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R&#x2014;NH&#x2014;CH&#x2014;NH&#x2014;Ror (CH&#x2014;NH&#x2014;CH&#x2014;NH&#x2014;CH)(wherein Rto Rrepresent &#x2014;OH, &#x2014;CH, &#x2014;CHOH, &#x2014;CHOH, &#x2014;CHN(CH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHNH(CHOH), &#x2014;CHN(CHOH), &#x2014;CHN(CHOH), &#x2014;CHN(CHOH)or &#x2014;CHN(CHOH), and n is an integer of 1 to 4). A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.

A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adhere at a high nuclei density of 2000 nuclei/&mgr;m or more. The metal catalyst particles are produced by sensitizing the non-conductive portion of the substrate by dipping the substrate in a sensitizing solution containing bivalent tin ions, activating the non-conductive portion of the substrate by dipping the substrate in a first activator containing silver ions, and activating the non-conductive portion of the substrate by dipping the substrate in a second activator containing palladium ions.

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Hirakata, Japan

Yoshikazu Saijo