Shin-Etsu Engineering Co., Ltd.

Shibaura Mechatronics Corporation

Yoshikazu Ohtani

Kyouhei Tomioka

Katsuhiro Yamazaki

Emi Matsui

Shunya Kubota

A workpiece-separating device includes: a holding member that detachably holds a workpiece of a laminated body in which the workpiece that includes a circuit board and a supporting body through which laser beams pass are laminated with each other via a separating layer that peelably alters due to at least absorption of the laser beams; a light irradiation part that irradiates the laser beams toward the separating layer through the supporting body of the laminated body held by the holding member; a driving part that relatively moves a light irradiation position of irradiation from the light irradiation part with respect to the supporting body and the separating layer of the laminated body held by the holding member in at least a direction crossing a light irradiation direction of irradiation from the light irradiation part; and a controlling part that operates and controls the light irradiation part and the driving part.

Workpiece-separating device and workpiece-separating method

A workpiece-separating device includes: a holding member which detachably holds one of the workpiece and the supporting body; a laser irradiation part which irradiates the separating layer with the laser beam through the other of the supporting body and the workpiece of the laminated body being held by the holding member; and a controlling part which controls an operation of the laser irradiation part, wherein the laser irradiation part has a laser scanner which moves the spot like laser beam along the laminated body, an entire irradiated face of the separating layer in an area of the laser beam irradiated from the laser scanner toward the laminated body is divided into a plurality of irradiation areas each having a band shape that is elongated in one of two directions intersecting a light irradiation direction from the laser irradiation part.

According to one embodiment, a substrate processing apparatus and a substrate processing method that can improve the quality of substrates are provided. The substrate processing apparatus according to one embodiment includes: a tableconfigured to support a processing target W including a substrate W, a ring Wsurrounding a surrounding of the substrate W, and a dicing tape Wadhered to a lower surface of the substrate Wand a lower surface of the ring W, and a liquid supplierconfigured to eject a liquid which does not mix with a processing liquid for processing the substrate Wand which has a specific gravity heavier than the processing liquid to one of an upper surface of the ring Wof the processing target W supported by the tablerotating by the rotation mechanism, an outer circumference end portion of the substrate Wof the processing target W supported by the tablerotating by the rotation mechanism, and between the substrate Wand the ring Wof the processing target W supported by the tablerotating by the rotation mechanism in accordance with a rotation number of the tableto supply the liquid between the substrate Wand the ring Wof the processing target W.

Substrate processing apparatus and substrate processing method

A workpiece-separating device includes a holding member configured to detachably hold one of a workpiece or a supporting body of a laminated body and a light irradiation part configured to perform light irradiation on a separating layer, the holding member including: a stage facing one of the workpiece or the supporting body, a fixed supporting part projecting from the stage toward the laminated body and including a still suction pad immovable in a projection direction, and a movable supporting part projecting from the stage toward the laminated body and including a response suction pad that is movable in a projection direction and elastically deformable, a plurality of the fixed supporting parts and a plurality of the movable supporting parts disposed in a dispersed manner, and the plurality of response suction pads project toward the laminated body further than the plurality of still suction pads.

A workpiece-separating device includes: a holding member that detachably holds a workpiece among a layered body in which the workpiece that includes a circuit board and a supporting body that allows laser beams to pass therethrough are layered with each other via a separating layer that peelably alters with absorption of the laser beams; a laser irradiation part that performs irradiation of Gaussian beams pulse-oscillated as the laser beams toward the separating layer through the supporting body of the layered body held by the holding member; and a controlling part that controls an operation of the laser irradiation part, wherein the controlling part controls a distance between centers of the adjacent Gaussian beams of the laser beams pulse-oscillated from the laser irradiation part to be less than three times of a standard deviation when a relationship between a beam diameter and irradiation intensity is assumed as a normal distribution.

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Gunma, Japan

Yoshikazu Ohtani