Sharp Kabushiki Kaisha Corporation

Yoshikazu Ohara

Yoshihiro Sekimoto

Kazuo Kinoshita

Yoshinori Tanida

Tetsuya Fujimoto

Provided is a camera module capable of securing air permeability in an imaging portion of the camera module and reducing failure (speck failure) of an image sensor, which is caused by adhesion of a foreign matter. In a camera module in which an internal space is formed by a wiring substrate, a cover body (), and a transparent plate (), a ventilation groove () which extends from the internal space to an outside of the internal space and a recess part () which is formed so as to branch off from the ventilation groove () are formed on a surface of the cover body (), which adheres to the transparent plate ().

Camera module including ventilation groove and recess portion

A camera module () has an internal space () that abuts a wiring substrate () and is occluded, at least a part of a base material of the wiring substrate () is a porous portion () that is configured of porous ceramic, porous metal, organic fabric, or inorganic fabric and has interconnected air holes, and the internal space () is connected to the outside of the camera module () through the interconnected air holes.

Camera module

A camera module of the present invention includes a plurality of projectionson a bottom base of a driving sectionof an AF/Zoom module. The projectionsare radially extended from an apertureformed on an optical path. By this, adhesive can be spread over the projectionswhen bonding a lens holder and the AF/Zoom module together. Furthermore, even if the adhesive is excessively applied, excessive adhesive can be retained between the projections. As a result, it is possible to realize a solid-state imaging device which makes it possible to improve adhesive strength between the lens holder and the AF/Zoom module and easily bond the lens holder and the AF/Zoom module.

Solid-state imaging device and electronic device including same

To provide a semiconductor device capable of corresponding to an applied bending stress by flexibly changing its shape, and to provide a semiconductor device module, a manufacturing method of the semiconductor device, and a manufacturing method of the semiconductor device module. In a silicon substrate whose front surface is provided with an element forming layer having an element forming region where a semiconductor element is formed, a groove is formed in a portion of the rear surface of the silicon substrate corresponding to a region of the element forming layer where a semiconductor element is not formed.

Growing community of inventors

Sakai, Japan

Yoshikazu Ohara