Taiyo Yuden Co., Ltd.

Yoshikazu Maruyama

Masataka Kohara

Ichiro Yokoyama

Keiichi Nozawa

Masakazu Okazaki

Noriyuki Mabuchi

Tomoyuki Oyoshi

Chikako Yoshida

Ikuo Kakiuchi

Hideaki Hoshino

Masami Seto

Takehumi Yamada

Kazuhiko Oyama

Masuo Yatabe

Kenji Okabe

Toshifumi Kawata

Kazuhiko Nakamura

In an exemplary embodiment, a coil component includes: an element body partand a coilof spiral shape constituted by multiple turn unitsconnected in a coil axial direction; wherein each turn unithas, in a cross-sectional view in the width direction of the turn unit, a flat sidethat extends in a second direction substantially perpendicular to the coil axis of the coil; and the point of intersectionbetween a figure linecorresponding to the longest part in a first direction, and a figure linecorresponding to the longest part in the second direction, with respect to the coil axis, is positioned on the figure linewithin one-quarter of the figure line away from one endon the sideor from the other endopposing the side

Coil component with coil having certain cross-sectional shape

An electronic component includes: an insulator part () of rectangular solid shape; a coil element () provided inside the insulator part (); bottom electrodes () provided on a bottom face () of the insulator part () and electrically connected to the coil element (); a plating layer () provided in a manner overlapping each bottom electrode () so that its end () on the bottom face () is away from the end () of the bottom electrode (); a plating layer () which is arranged between the bottom electrode () and the plating layer () and overlaps the bottom electrode (), and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer (); and an insulation layer () provided on the bottom face () in a manner covering the end () of the bottom electrode ().

Electronic component and electronic apparatus

In an embodiment, an electronic component includes: an insulator partof rectangular solid shape; a coil elementprovided inside the insulator part; bottom electrodesprovided on a bottom faceof the insulator partand electrically connected to the coil element; a plating layerprovided in a manner overlapping each bottom electrodeso that its endon the bottom faceis away from the endof the bottom electrode; and a plating layerwhich is arranged between the bottom electrodeand the plating layerand overlaps the bottom electrode, and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer. The electronic component can suppress generation of cracking in the insulator part.

Electronic component, electronic apparatus, and method for manufacturing electronic component

In an embodiments, a coil component includes: an element body partand a coilof spiral shape constituted by multiple winding conductorsand through hole conductorsthat interconnect the winding conductors; wherein each winding conductorhas, in a cross-sectional view in the width direction of the winding conductor, a flat sidethat extends in a second direction substantially perpendicular to the coil axis of the coil; and the point of intersectionbetween a figure linecorresponding to the longest part in a first direction, and a figure linecorresponding to the longest part in the second direction, with respect to the coil axis, is positioned on the figure linewithin one-quarter of the figure line away from one endon the sideor from the other endopposing the side

Coil component and method for manufacturing coil component

One object of the present invention is to enable identification of the direction of an electronic component, while suppressing increase in cost. The present invention provides an electronic component comprising: an insulator portion having a plurality of surfaces (e.g., a top surface, a bottom surface, end surfaces, and side surfaces), the insulator portion including a plurality of regions having different transmissivities of a light beam entering one of the plurality of surfaces (e.g., a top surface, a bottom surface, end surfaces, and side surfaces); an internal conductor portion provided in the insulator portion; and external electrodes provided on the insulator portion and electrically connected to the internal conductor portion.

Electronic component

A group of magnetic sheets are stacked and connected via through-holes, on each of which magnetic sheets a circling pattern having connection parts at its corners and ends is formed to form a spiral coil pattern. Leader patterns each have a leader part formed at a position not overlapping with the circling parts of the coil pattern and connected to an external terminal electrode, as well as two connection parts that continue to the leader part and are formed at positions corresponding to the connection parts of the circling patterns, together with a cutout formed between the two connection parts. Magnetic sheets with the leader patterns are provided at the top and bottom of the laminate forming the coil pattern. The multilayer chip inductor can suppress decrease in core area caused by displacement due to the stacking.

Multilayer chip inductor and production method for same

A multilayer inductor having a uniformly improved direct current superposition property and an increased inductance value is disclosed. The multilayer inductor contains a laminate of a plurality of first insulating layers and a plurality of conductive layers, and the conductive layers and through hole conductors are connected to form a helical coil in the laminate. A second insulating layer which has a magnetic permeability lower than those of the first insulating layers is disposed such that it crosses an inner magnetic path of the helical coil, and a margin of the second insulating layer overlaps with the conductive layer in the stacking direction and is in contact with the conductive layer in the overlap portion. The magnetic flux density in the laminate is likely to be highest in the overlap portion, and thus, the highest-density magnetic flux passes through the second insulating layer inevitably, whereby the direct current superposition property can be uniformly improved.

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Takasaki, Japan

Yoshikazu Maruyama