Tdk Corporation

Showa Denko K.k.

Yoshikazu Kanemaru

Kenichi Kawabata

Kenji Tamura

Takaaki Morita

Motoyuki Hirata

Hiroshige Ohkawa

Kouhei Nakanishi

A solar cell covered with a transparent plate through a predetermined gap includes a flexible power generating layer which photoelectrically converts light incident thereon through the transparent plate, a resin layer covering a light receiving surface of the power generating layer, and an adhesion preventing layer covering the surface of the resin layer and facing the transparent plate through the gap. The adhesion preventing layer is made of an inorganic material and has a surface roughness Sz of 1 nm or more and 500 nm or less. Thus, the outermost surface of the solar cell is constituted by the adhesion preventing layer, so that no tack mark occurs even when partial contact occurs between the solar cell and the transparent plate which face each other through the gap. As a result, it is possible to prevent deterioration in appearance due to the tack mark.

Solar cell and electronic device having the same

The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work boardincludes an insulating layeron one surface of a substantially rectangular-shaped substrate, and electronic componentsand a plate-like integrated frameare embedded inside the insulating layer. The plate-like integrated framehas a plurality of concave portionsarranged in parallel at its inner periphery wall, and arranged on a non-placing area of the electronic componentsso as to surround a plurality of the electronic components(groups).

Assembly substrate and method of manufacturing the same

A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheetincludes insulating layersandon one surface of an approximately rectangular substrate, and an electronic componentand a plate-like frame member (member)embedded inside the insulating layer, wherein the plate-like frame membersatisfying the relationship represented by the following formula (1): &#x3b1;and &#x3b1;. . . (1), is mounted on an unmounted portion of the electronic componenton the substrate. In the formula, &#x3b1;and &#x3b1;respectively denote the linear coefficients of thermal expansion (ppm/K) of the electronic component, the plate-like frame member, and the substrate, the respective wiring layers or the respective insulating layers.

Electronic component-embedded board and method of manufacturing the same

The photosensitive composition of the present invention comprises a photocurable component containing a urethane (meth)acrylate compound (A) having a carboxyl group; a thermosetting resin (C); a photopolymerization initiator (D); and a thermopolymerization catalyst (E); and the above-mentioned photocurable component further contains at least one of (B) a compound having an ethylenically unsaturated group, excluding the component (A), and an epoxy (meth)acrylate compound (F) having a carboxyl group. Therefore, the photosensitive composition is suitable for use as an insulating protective coating film for printed circuit boards. Since the cured film made of the photosensitive composition of the present invention is particularly superior in pliability, curling does not occur even when used for a thin circuit board. Therefore, the cured film is best suited for use in an FPC board.

Growing community of inventors

Tokyo, Japan

Yoshikazu Kanemaru