Shinko Electric Industries Co., Ltd.

Yoshikazu Hirabayashi

Tadashi Arai

Tadashi Kodaira

Hidetoshi Arai

Shinichi Wakabayashi

Shigeo Nakajima

Kazuhiro Oshima

Noboru Sakaguchi

Kunihiko Imai

Yoshitaka Matsushita

Yoshiro Nishiyama

A wiring substrate includes a first substrate and a second substrate stacked on the first substrate. The first substrate includes a first adhesive layer and conductive paste. The first adhesive layer is on a surface of a first insulating layer. The conductive paste is in an opening in the first adhesive layer. The second substrate includes a second adhesive layer and a protruding electrode. The second adhesive layer is on a surface of a second insulating layer facing toward the first substrate, and is bonded to the first adhesive layer. The protruding electrode has an end uncovered by the second adhesive layer, and is electrically connected to the conductive paste.

Wiring substrate

A semiconductor device includes a wiring substrate, a semiconductor chip, conductive paste, and an adhesive layer. The wiring substrate includes an insulating layer and a wiring layer on a surface of the insulating layer. The semiconductor chip includes a circuit-formation surface in which an electrode pad is provided, and is mounted on the wiring substrate with the circuit-formation surface facing toward the wiring layer. The conductive paste electrically connects the wiring layer and the electrode pad. The adhesive layer is over the entirety of the surface of the insulating layer, and covers the wiring layer and the conductive paste. The adhesive layer fills in a gap between the surface of the insulating layer and the circuit-formation surface, to bond the wiring substrate and the semiconductor chip. The adhesive layer extends onto a side surface of the semiconductor chip to form a fillet.

Semiconductor device

A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion.

Wiring board having lead pin, and lead pin

A ceramic package used for a semiconductor device comprises a ceramic base including a die-bonding area and wire-bonding areas defined. A metal underlayer formed on the die-bonding or wire-bonding areas essentially consists of two-plated layers of: a cobalt layer plated on the ceramic base and a nickel layer plated on the cobalt layer. The underlayer is annealed and, them, a gold-plated layer is formed on the underlayer.

Ceramic package for semiconductor device

Growing community of inventors

Nagano, Japan

Yoshikazu Hirabayashi