Dai Nippon Printing Co., Ltd.

Yoshikazu Fukushima

Jun Takahashi

Seiichi Nishikawa

Kazuyoshi Irisawa

Akiko Moriyama

Mayumi Inada

Hiroshi Harima

Masaki Wakamatsu

Masao Gogami

A sheet-framed IC carrier has a sheet frame having an aperature, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperature of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

Sheet-framed IC carrier, method for producing the same, and IC carrier case

A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

An IC card (1) has a base card (2), and an IC module (10) placed in a cavity (3) formed in one surface of the base card (2). The IC module (10) comprises a substrate (11), a contact layer (15) formed on one surface of the substrate (11), an IC chip (12) attached to the other surface of the substrate (11), and a frame (14) attached to the other surface of the substrate (11). A space defined by the frame (14) is filled up with an encapsulating resin (13) so as to encapsulate the IC chip (12). A deflection per unit length of the substrate (11) under a predetermined load is greater than that of the base card (2) under the same load. When a bending force is applied to the IC card (1), a portion around the IC chip (12) is protected by the encapsulating resin (13) and the frame (14), and portion of the substrate (11) other than the portion around the IC chip (12) is distorted greatly to absorb the bending force.

Apparatus and method of manufacturing an integrated circuit (IC) card

Sheet-framed IC carrier, method for producing the same, and IC carrier

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Tokyo, Japan

Yoshikazu Fukushima