Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Yoshikatsu Mikami

Noriyuki Kinjo

Isao Tsukagoshi

Koji Fujisaki

Junichi Imaizumi

Shun-ichi Numata

Hisashi Dokochi

Kunihiko Nishi

Mitsuo Usami

Hideji Kuwajima

Yutaka Yamaguchi

Shozo Yamana

Hiroshi Wada

Atsuo Nakajima

Junichi Kikuchi

Masakatsu Suzuki

Yukihisa Hirosawa

Hiroshi Matsuoka

Toshikazu Ono

Kuniteru Muto

Yoshiyuki Ikezoe

Semiconductor integrated circuit card assembly

Composite electroconductive powder, electroconductive paste, process for

A semiconductor device comprising a semiconductor chip, a wiring substrate, and an adhesive preferably containing electroconductive particles interposed therebetween, a plurality of spacer elements being present on or below the adhesive layer, said spacer elements having almost the same height as surrounding projecting electrodes and at least one shape selected from circles and polygons when viewed from the top, within an area surrounded by the connected electrodes, has a high flexural strength and high reliability and can be used for information cards, and the like.

Semiconductor device having a semiconductor chip electrically connected

A resin material comprising a polyamide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.

Low thermal expansion resin material and composite shaped article

Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insulating adhesive component.

Anisotropic-electroconductive adhesive composition, method for

A resin material comprising a polyimide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.

Growing community of inventors

Shimodate, Japan

Yoshikatsu Mikami