Kaneka Corporation

Yoshikatsu Ichiryu

Masayuki Fujita

Takao Manabe

Katsuya Ouchi

Jun Kotani

Masahito Ide

Susumu Amano

Hirofumi Inari

Aki Kitajima

A photosensitive composition contains a polysiloxane compound, a photoacid generator, a coloring agent and a solvent. A content of the coloring agent with respect to a total solid content of the composition is 5% by weight or more. The polysiloxane compound contains a cyclic polysiloxane structure and a cationically polymerizable functional group. The polysiloxane compound may further have an alkali-soluble functional group. A content of the polysiloxane compound with respect to the total solid content of the composition is preferably 20-80% by weight. The photosensitive composition is used, for example, in formation of a colored pattern.

Photosensitive composition, colored pattern and method for producing same

A composition for use as material for electrical or electronic parts, comprising (A) a vinyl polymer having, at a molecular terminal thereof, at least one (meth)acryloyl group per molecule of the polymer, (B) a vinyl monomer having a (meth)acryloyl group and (C) an initiator, wherein the component (B) is comprised in an amount of from 25% by weight or more to 45% by weight or less to the total 100% by weight of the components (A) and (B).

Composition for use as material for electrical or electronic parts, and cured product thereof

An object of the invention is to provide a curing agent and a curable composition capable of forming a cured product, which is applicable for optical material and which has excellent heat and light transparency and crack resistance, and a cured product obtained by curing the same. Moreover, an object of the invention is to provide a method for producing with use of the components of the curing agent a cyclic polyorganosiloxane having a specific structure, in a selective manner and in high yield. In order to attain the objects, a curable composition including, as essential components, (A) an organic compound including at least two carbon-carbon double bonds that are reactive with a SiH group, (B) a compound having at least two SiH groups per molecule, and (C) a hydrosilylation catalyst, uses a modified polyorganosiloxane compound having at least two SiH groups per molecule as the compound having at least two SiH groups, which modified polyorganosiloxane compound is a reaction product of a specific cyclic polyorganosiloxane.

Process for production of cyclic polyorganosiloxane, curing agent, curable composition, and cured product of the curable composition

Cured products constituted with conventional epoxy compounds have been disadvantageous in heat-resistant and light-resistant transparency, and crack resistance. An object of the present invention is to provide: a modified polyorganosiloxane compound having an epoxy group and/or an oxetanyl group which provides a cured product that is excellent in heat-resistant and light-resistant transparency, and crack resistance; a curable composition thereof; and a cured product obtained by curing the same. Disclosed is a modified polyorganosiloxane compound having two or more epoxy group and/or oxetanyl group in a molecule, the compound being a hydrosilylation reaction product of the following compounds:

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Settsu, Japan

Yoshikatsu Ichiryu