Omron Corporation

Yoshikaga Taguchi

Koichi Takemura

Tomofusa Shibata

Yoshihisa Yamanaka

Masayuki Kojima

Kenji Suzuki

Yoshinori Ito

Kazutaka Kaneko

Masayuki Shinohara

Norikazu Kitamura

Kazuhide Hirota

Hiroyuki Miyaura

Mitsuhiro Kawai

Isao Makuta

Kiyoaki Kuzukawa

Yukihiro Takahashi

Hitoshi Nakano

Masayoshi Tani

Yuzuru Fujie

Ryutaro Tsuchiya

Naoki Hashimoto

Taichi Suzuki

Senjiro Ishibashi

Kazuo Yamada

Kiyoshi Oka

A mold structure has a first mold, a second mold relatively connectable to and disconnectable from the first mold, a heater on at least one of the first and second molds, a transfer member on at least one of the first and second molds, that is relatively movable and separable from the at least one of the first and second molds on which the transfer member is disposed, a transfer surface formed on the transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet, and a moving mechanism that moves the at least one of the first and second molds on which the transfer member is disposed and the transfer member relative to each other.

Mold structure, transfer molding apparatus, and transfer molding method

A transfer molding method includes supplying melted resin to a first metallic mold, conveying the first metallic mold onto which the resin was supplied to a position opposing a second metallic mold, performing transfer molding by sandwiching the resin between the two metallic molds, and cooling the resin after performing transfer molding. The performing transfer molding includes discharging residual air that remains in a recess via a groove portion.

Metallic mold structure, transfer molding apparatus, transfer molding method, and optical member forming apparatus

A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.

Transfer molding method and transfer molding apparatus

A method for producing a light guide plate includes forming a light introduction part that introduces light incident through an end face, and forming a light guide plate body that has a thickness less than a maximum thickness of the light introduction part, forming the light guide plate body to be continuously joined to the light introduction part, and forming the light guide plate body so as to cause a light controller to output the incident light to an outside. The light guide plate producing method further includes a conveying step of conveying a resin sheet between a first die and a second die, which are disposed while facing each other, wherein a transfer surface is provided in at least one of surfaces facing each other in the first and second dies.

Light guide plate producing method, die structure, transfer molding apparatus, light guide plate, area light source device, liquid crystal display device, and mobile device

Electromagnetic relay and its manufacture

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Shiga, Japan

Yoshikaga Taguchi