Shimizu Co., Ltd.

Other

Yoshiji Shimizu

Masao Fukuda

Michio Osada

Keiji Maeda

Yoshihisa Kawamoto

Susumu Yamahara

Toshiyuki Nishimura

Shigefumi Nishimura

A die used for molding an electronic component with resin includes a fixed, top die and a movable, bottom die and at least has a surface contacting a melted resin material that is electroplated with nickel-tungsten alloy. This plating can provide releaseability of a resin-molded body and the like superior to hard-chromium plating to allow an ejector pin to efficiently eject and release the resin-molded body from the die.

Die used for resin-sealing and molding an electronic component

An ultraviolet curable coating composition for cationic electrodeposition applicable to metal plated materials which composition comprises 100 weight parts of acrylic resin containing 10 to 70% by weight poly-functional acrylate per se having 3 or more acryloyl groups and 90 to 30% by weight of a resin of molecular weight 2,000-30,000 having a cationic electrodeposition property, and 0.1-10 weight parts of 2 or more species of photopolymerization initiators which absorb ultraviolet radiation in a wavelength range of 300-400 nm, as effective ingredients. The coating composition can readily be deposited electrically on metal materials including plated products and plastic materials provided with electrical conductivity and cured by irradiation of ultraviolet radiation within a short period of time to give a dry coating film which is appreciable in adhesiveness to the plated materials and good in appearance. Particularly, since the ultraviolet irradiation can be carried out at ordinary temperature, the method can be applied to non-heat-resistant materials such as plastics provided with electrical conductivity.

Ultraviolet curable coating compositions for cationic electrodeposition applicable to metallic materials and electrically conductive plastic materials

The invention provides a bath for immersion plating a substance with a tin-lead alloy, which includes tin(II) ions, lead(II) ions, organic sulfo groups and thiourea or a mixture of thiourea and a thiourea derivative for a complexing agent. The organic sulfo groups allow insoluble thiourea complexes to be stably dissolved in the solution of the bath; thereby there is no need to retain the bath at a high temperature. Compared with conventional baths for immersion plating, the bath of the invention attains stable plating and a longer life of itself. Addition of the thiourea derivative prevents whiskers from being deposited and allows uniform and sufficiently smooth plating.

Bath for immersion plating tin-lead alloys

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Osaka, Japan

Yoshiji Shimizu