Lan Technical Service Co., Ltd.

Tadatomo Suga

Isabers Japan Co. Ltd.

Other

Taiyo Yuden Co., Ltd.

Bondtech Co., Ltd.

Suga, Tadatomo

Yoshiie Matsumoto

Akira Yamauchi

Ryuichi Kondou

Methods of bonding substrates are provided, including forming a thin film of a metal oxide on a bonding surface of both or either of a pair of substrates, at least one of which is a transparent substrate, and contacting the bonding surfaces of the pair of substrates with each other via the thin film of the metal oxide.

Method for bonding substrate, transparent substrate laminate, and device provided with substrate laminate

A method of bonding transparent substrates is provided, comprising: preparing a pair of transparent substrates; forming a thin film of aluminum oxide by a sputtering method, on a bonding surface of the transparent substrates; contacting the aluminum oxide thin films in the air to bond the pair of transparent substrates; and heating the bonded pair of transparent substrates.

Method for joining transparent substrates

[Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.

Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly

[Problem] To provide a technology that allows a film or glass to be bonded to a transport substrate and to be easily separated during the manufacture of a substrate. [Solution] Provided is a method for manufacturing a substrate having an electronic device formed on a surface, the method comprising a formation step for forming an inorganic material layer on at least one of a bonding surface by which the substrate having an electronic device formed on a surface is to be bonded to a transport substrate, and a bonding surface on the transport substrate for transporting the substrate; a bonding step for pressing the substrate and the transport substrate against each other and bonding the substrate and the transport substrate by the inorganic material layer; and a separation step for separating the substrate and the transport substrate.

Thin substrate, method for manufacturing same, and method for transporting substrate

The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S) for forming a first inorganic material layer on part or all of a first polymer film; a step (S) for forming a second inorganic material layer on part or all of a second polymer film; a step (S) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together.

Method for bonding polymer film and polymer film, method for bonding polymer film and inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrate

[Problem] The aim of the invention is to provide a method of sealing an electronic element such as an organic EL element using a normal temperature bonding method that enables bonding at low temperature and in which permeation of external gases such as hydrogen or oxygen through the sealed section (dam) formed by the organic material, or the junction interface of the sealed section and a cover substrate is suppressed. [Solution] A method of sealing an electronic element comprises a step of forming a sealing section by forming a sealing section including an organic material on the surface of a first substrate formed with the electronic element, surrounding this electronic element with a thickness that is larger than that of this electronic element; a step of forming a first inorganic material layer in which a first inorganic material layer is formed at least on the exposed surface of this sealing section; and a substrate bonding step of bonding the first substrate and the second substrate by pushing together the sealing section of the first substrate and the junction location of the second substrate.

Electronic element sealing method and bonded substrate

A connecting device for display panel substrates provided with a first surface table and second surface table for holding the first and second substrates. The connecting device includes a spacer having a thickness substantially equal to a prescribed cell gap, and an operating device for inserting the spacer in between the substrates, or withdrawing the spacer from the same. The connecting device also includes hardening device for hardening sealant material.

Device for connecting display panel substrates comprising a spacer having a plurality of spacer elements or a rotatable head section for controlling cell gap

A method for connecting display panel substrates comprises the following steps. Firstly, a first substrate and a second substrate, whereon sealant material is disposed so as to form a waste region in the inner side region of the edges of the first and second substrates, are aligned in position and held. Thereupon, a spacer having a thickness substantially equal to a prescribed cell gap is inserted into the waste region between the first and second substrates. Next, the cell gap is determined by pressing the first and second substrates. The sealant material is then hardened, whereupon the spacer is withdrawn. In this connecting process for fabricating a display panel, the cell gap can be set readily and precisely to a high degree of accuracy.

Method and device for connecting display panel substrates

A liquid crystal sealing device which supplies sealing material for sealing liquid crystal injection holes of sealing areas of a multiplicity of liquid crystal cells simultaneously. This device has a multiplicity of pins which are arranged to match the arrangement of the sealing areas of the multiplicity of liquid crystal cells so that the sealing material can be transferred from a container storing the sealing material to the corresponding sealing area of the liquid crystal cell. This device also has a reciprocating mechanism for reciprocating the multiplicity of pins, as one unit, between a position where the sealing area is to be positioned and the container. This device also has a vertical micro-motion mechanism which minutely moves each one of the multiplicity of pins vertically, with the position, which is designed to be the position for attaching the sealing material to the sealing area, as the center, and a horizontal micro-motion mechanism which minutely moves each one of the pins horizontally, with this designed position as the center.

Growing community of inventors

Tokyo, Japan

Yoshiie Matsumoto