Toshiba Mitsubishi-electric Industrial Systems Corporation

Tohoku University

Yoshihito Yamada

Hisaaki Yamakage

Akihiro Ichinose

Shinichi Nishimura

Kensuke Watanabe

Tadahiro Ohmi

Hiroshi Kobayashi

Yoichiro Tabata

Akinobu Teramoto

Masafumi Kitano

Ren Arita

Masato Hanada

Tomoyuki Suwa

Yoshinobu Shiba

Junichi Uno

Takeshi Funabiki

A lead wire storage mechanism stores most of a lead wire such that the lead wire can be taken out from a tip end portion. A tension adjusting mechanism including a dancer roller and two lifting and lowering guide rollers is formed with a partial space that is to be a part of a hand travel space at a time of a preparation state. A lead wire guide mechanism including an opening and closing lead guide is formed with a partial space that is to be a part of the hand travel space at the time of the preparation state. A lead wire grasping and moving mechanism can execute a grasping operation for grasping a tip end portion of the lead wire with a grasping part, and a grasping part moving operation for moving the grasping part through the hand travel space.

Lead wire pulling out mechanism

In an ultrasonic bonding method, three ultrasonic bonding head units are disposed above a bonding target. At this time, initial heights in the three ultrasonic bonding head units are set to different heights from each other. Thereafter, a batch multiple lowering operation by a lifting-lowering servomotor and ultrasonic vibration operations by the three ultrasonic bonding head units are executed. At this time, a lowering speed Vof the batch multiple lowering operation, an operation time T(min) of the ultrasonic vibration operation, and an adjustment gap length &#x394;g among the initial heights are set to satisfy {T&#x3c;&#x394;g/V

Ultrasonic bonding method

First and second operations are executed under control of a peeling inspection control apparatus functioning as a peeling and grasping control unit. In the first operation, a processed surface contact state in which a processed outer peripheral surface of a contact roller and a surface of a lead wire are in contact with each other is maintained, and contact roller rotation operation is executed in which the contact roller is moved on the surface of the lead wire while the contact roller is being rotated. During execution of the first operation, a tip portion of the lead wire is peeled from a glass substrate. Thereafter, in the second operation, grasping operation is executed in which the tip portion of the lead wire peeled from the glass substrate is grasped by a grasping mechanism.

Peeling and grasping apparatus, peeling inspection apparatus, and ultrasonic vibration bonding system

The present invention has features (1) to (3). The feature (1) is that 'an active gas generation electrode group is formed in such a manner that a ground side electrode component supports a high-voltage side electrode component'. The feature (2) is that 'stepped parts are provided in a discharge space outside region of a dielectric electrode in the high-voltage side electrode component, and project downward, and by a formation height of these stepped parts, the gap length of a discharge space is defined'. The feature (3) is that &#x201c;the high-voltage side electrode component and the ground side electrode component are formed to have the thickness of a discharge space formation region relatively thin and the thickness of a discharge space outside region relatively thick&#x201d;.

Active gas generation apparatus

An ultrasonic vibration welding apparatus includes an air cylinder that is coupled to an ultrasonic welding head unit and executes a pressurizing operation of pressurizing on the ultrasonic welding head unit, and a lifting-lowering servomotor that executes a lifting-lowering operation including a lowering operation of lowering the ultrasonic welding head unit and the air cylinder at once, as components separate from each other.

Ultrasonic vibration welding apparatus

A bonding tool that executes an ultrasonic vibration processing of applying ultrasonic vibration to an application portion on a lead wire from a direct contact tip portion and a pair of press mechanisms having a pair of press rollers capable of performing a rotational operation. The pair of press mechanisms executes a press processing of pressing both sides of the application portion on the lead wire by the pair of press rollers at a time of execution of the ultrasonic vibration processing by the bonding tool and a movement processing of executing a rotational operation performed by the pair of press rollers to move the pair of press rollers on the lead wire while pressing the lead wire at a time of non-execution of the ultrasonic vibration processing.

Ultrasonic vibration bonding apparatus

A bonding tool as the tool for ultrasonic bonding includes a plurality of protrusion portions in a protrusion region at a contact tip portion. The plurality of protrusion portions are equally spaced at a longitudinal direction interval in an X direction as the longitudinal direction of the protrusion region, and an X direction outermost protrusion portion positioned outermost in the X direction is disposed separately from a side edge of the protrusion region in the X direction by a longitudinal direction side edge distance. The plurality of protrusion portions are disposed so that a first disposition condition {0.349&#x2264;EX (the longitudinal direction side edge distance/DX (the longitudinal direction interval)&#x2264;0.510} is satisfied.

Tool for ultrasonic bonding and apparatus for ultrasonic bonding

A method of forming a nitride film wherein (a) a silane-based gas is supplied to a processing chamber through a gas supply port; (b) a nitrogen radical gas from a radical generator is supplied to the processing chamber through a radical gas pass-through port; and (c) the silane-based gas supplied in (a) is reacted with the nitrogen radical gas supplied in (b), without causing a plasma phenomenon in the processing chamber, to form a nitride film on a wafer.

Method of forming nitride film

With respect to a dielectric electrode, gas-jetting holes and gas-jetting holes formed in two rows along the X direction are provided as three or more gas-jetting holes along the X direction in a central region. By providing a difference in the X direction between the position where the gas-jetting hole is formed and the position where the gas-jetting hole is formed, the gas-jetting holes and the gas-jetting holes disposed in two rows are provided such that gas-jetting holes and gas-jetting holes are alternately disposed along the X direction.

Active gas-generating device and film formation apparatus

An active gas generator that generates active gas by activating supplied material gas through discharge in a discharge space formed between a high-voltage side electrode component and a ground side electrode component of an active gas generation electrode group. A combined structure of covers completely separates the discharge space from an alternating-current voltage application space, and includes, independently from the alternating-current voltage application space, a material gas flow path for a material gas supply path, through which externally supplied material gas is guided to the discharge space. A housing contact space formed between a metal housing and each of the covers and an electrode component installation table is completely separated from the alternating-current voltage application space and the discharge space.

Active gas generation apparatus including a metal housing, first and second auxiliary members, and a housing contact

An activated gas generation apparatus includes a gas jet flow straightener below an activated gas generating electrode group and a nozzle constituent part. The gas jet flow straightener receives a plurality of nozzle passing activated gases as a whole at an inlet part of a gas flow-straightening passage. The gas flow-straightening passage is formed so that the outlet opening area of an outlet part is set to be narrower than the inlet opening area of the inlet part, and the cylindrical gas jet of each of the plurality of nozzle passing activated gases is converted into a linear flow-straightened activated gas by the flow-straightening action of the gas flow-straightening passage.

Activated gas generation apparatus

A heating device which transfers heat isothermally to an object to be heated. The heating device includes: a block and a base plate which surround a pipe; a first heat insulating cover which covers an outer periphery of the block and the base plate and forms a first heat insulating layer; and a second heat insulating cover which covers an outer periphery of the first heat insulating cover and forms a second heat insulating layer. The first heat insulating cover includes first heat insulating covers fixed to the block and the base plate respectively. The second heat insulating cover includes second heat insulating covers fixed to each of the first heat insulating covers respectively. The heating device further includes snap locks which detachably fixes the second heat insulating covers.

Heating device

A heat equalizer includes a container structure, a material feed pipe, and a heating mechanism. The container structure includes an inner container and an outer container. In the outer container, a working fluid is held. Respective upper ends of the inner container and the outer container are joined to form a hollow portion between the inner container and the outer container. The material feed pipe extends from an outside of the container structure to the inner surface of the inner container. The heating mechanism is placed at the bottom of the outer container. At the bottom surface of the inner container, a plurality of protrusions protruding toward the inside of the inner container and depressions formed by the bottom surface depressed inward of the protrusions and capable of receiving the vaporized working fluid are formed.

Heat equalizer

A heat transfer device that allows high-accuracy temperature management of an entire piping system. The heat transfer device transferring heat to the piping system through which a fluid flows includes: a high heat conductive heat transfer block surrounding the piping system; a heat pipe embedded in the heat transfer block along an extension direction of the piping system; and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extension direction of the piping system.

Growing community of inventors

Tokyo, Japan

Yoshihito Yamada