Denso Corporation

Yoshihito Takahashi

Kazuya Takeuchi

Daisuke Ito

Kenji Shibata

A power conversion device includes a semiconductor module, a cooling device, a case, which accommodates the semiconductor module and the cooling device, a connector, which is connected to an inlet pipe, which is a refrigerant flow pipe of the cooling device, and a sealing member, which seals between the inlet pipe and the connector. The connector includes a pipe portion, which communicates with the inlet pipe, and a flange portion, which is secured to the case. The pipe portion and the flange portion are joined to each other with the pipe portion located in an insertion hole of the flange portion.

Power conversion device

A method of manufacturing a multilayer substrate includes preparing a plurality of substrates, stacking the substrates with bonding sheets interposed, and a first bonding process of bonding the substrates to each other by partially heating the stacked substrates by a heater and partially melting the bonding sheet. Each of the substrates is provided with a through-hole and a metal film covering an inner peripheral surface of the through-hole. In the first bonding process, the metal film is heated by the heater and heat is transferred from the heater to the bonding sheet via the metal film.

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Toyota, Japan

Yoshihito Takahashi