Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Yoshihito Otsubo

Norio Sakai

Mitsuyoshi Nishide

Shinichiro Banba

Issei Yamamoto

Tadashi Nomura

Minoru Hatase

Yuta Morimoto

Yukio Yamamoto

Takanori Uejima

Takafumi Kusuyama

Takahiro Kitazume

Motohiko Kusunoki

Nobuaki Ogawa

Yosuke Matsushita

Hideo Nakagoshi

Keisuke Araki

Junji Kurobe

Ryoichi Kita

Yoshihisa Masuda

Naoya Murakita

Kyo Shin

Tetsuya Kanagawa

Jun Sasaki

Satoshi Ishino

Keiichi Ichikawa

Jun Adachi

Takayuki Tsukizawa

Yuki Ito

Haruhiko Mori

Kenji Kubota

Bunta Okamoto

Tetsuya Oda

Tatsuyuki Yamada

Akihiro Fujii

Syuichi Onodera

Kunihiro Miyahara

Hirofumi Oie

Hideki Shinkai

Isamu Morita

Tatsunori Kan

Muneyoshi Yamamoto

Takayuki Tange

Makoto Osamura

Osamu Yamaguchi

Tsuneo Murata

Shota Sato

Takuya Murayama

Munetake Miyashita

Tsuyoshi Takakura

Takashi Osawa

Hideaki Hashi

Takeshi Wake

Yasuhiro Higashide

Yoshitaka Matsukawa

Minoru Komiyama

Daisuke Tsuruga

Toru Meguro

Yuji Kataoka

Asato Fujimoto

Masaaki Minami

Takao Okano

Shigeru Endo

Takayoshi Yoshikawa

Atsuko Omori

Yoriyuki Matsumoto

Hiroaki Tsuchida

Kunio Iwakoshi

Akinori Takezawa

A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film covering the first component along a shape of the first component and covering a part of the first surface; and one or more wires disposed to extend over the first component on a side of the resin film farther from the substrate.

Module

A module includes: a substrate including a first surface and including first and second sides; a component as a first component mounted on the first surface; a first sealing resin arranged to cover the first surface and the first component; and a first shield film. An inclined portion is formed in the substrate. The substrate includes a first lead electrode arranged to be exposed to the inclined portion along the first side, and a second lead electrode arranged to be exposed to the inclined portion along the second side, and each of these is connected to the first shield film. A height of the second lead electrode is different from a height of the first lead electrode.

Module and component

A structure body includes a ceramic substrate including a first surface, a first conductor pattern arranged on the first surface, and a first columnar conductor connected to the first conductor pattern and extending in a direction of thickness in an orientation away from the ceramic substrate. The first columnar conductor is provided with a recess in an end surface on a side close to the ceramic substrate and the first surface is provided with a raised portion in conformity with the recess in a region where the first columnar conductor is superimposed.

Structure body and method of manufacturing the same

An electronic circuit module includes: a substrate; a first electronic component mounted on one main surface of the substrate; a substrate electrode provided on the one main surface; a second electronic component supported on a support surface opposite to a surface facing the one main surface of the first electronic component; a conductor provided on the support surface of the first electronic component; a wire connected to the conductor and the substrate electrode; and a component electrode provided on a surface of the second electronic component and electrically connected to the conductor.

Electronic circuit module

A module includes a substrate having a first surface, components as one or more components mounted on the first surface, a resin film covering the one or more components along a shape of the one or more components and covering part of the first surface, a first shield film formed to overlap the resin film, and a first sealing resin as a sealing resin disposed to cover the first surface, the one or more components, and the first shield film. A stack including the resin film and the first shield film has a first opening. A first columnar conductor is disposed to be electrically connected to the first surface through the first sealing resin and the first opening. The first shield film is electrically connected to the first columnar conductor in the first opening.

A module includes a substrate having a first surface and at least one recess on the first surface, and an electronic component mounted on the first surface. The electronic component is connected to the substrate via a plurality of bumps. All of the plurality of bumps are connected to the first surface inside any of the at least one recess. A height of the plurality of bumps is greater than a depth of the at least one recess. When viewed in a direction perpendicular to the first surface, a part of the electronic component is located outside an outer periphery of any recess selected from the at least one recess.

Module and method for manufacturing same

A module comprises: a substrate having a first surface; a first component that is mounted on the first surface; a first sealing resin that covers the first surface and at least a portion of the first component that is connected to the first surface; a first conductor pattern that is disposed on a surface of the first sealing resin that is farther from the first surface; and a wire that serves as a plurality of connecting conductors each electrically interconnecting the first surface and the first conductor pattern, wherein when viewed in a direction perpendicular to the first surface, the plurality of connecting conductors are disposed so as to surround the first component, and the first conductor pattern includes a frame-shaped portion that electrically interconnects the plurality of connecting conductors outside the first component successively.

A first sealing resin is disposed between a first lower main surface and a second upper main surface. An upper circuit board first mounting electrode is disposed on the first lower main surface. A lower circuit board first mounting electrode is disposed on the second upper main surface. A first component is mounted on the lower circuit board first mounting electrode and is disposed in the first sealing resin. A first conductor layer is disposed on an upper circuit board. As viewed in the downward direction, a heat conduction member overlaps the first component, is disposed in a space between the first lower main surface and the second upper main surface, and is coupled to the first conductor layer via a conductor. A part of a heat dissipation member is exposed from the first sealing resin in a direction orthogonal to an up-down axis.

Circuit module

A circuit module includes an upper circuit board, a lower circuit board, a first conductor member, a second conductor member, and a first component. The upper circuit board has a first upper main surface and a first lower main surface. The lower circuit board has a second upper main surface and a second lower main surface, is disposed below the upper circuit board, and overlaps the upper circuit board as viewed in the downward direction. The first component is mounted on the first lower main surface or the second upper main surface. The first conductor member is a metal pin and is connected to the first lower main surface. The second conductor member is a metal pin and is connected to the second upper main surface. The second conductor member is electrically connected to the first conductor member.

The module includes a substrate, a first component mounted on a first surface, a first sealing resin, and a first shield film. When viewed in a cross section taken along a plane perpendicular to the first surface, the substrate is formed with a step portion. The substrate includes a first extraction electrode disposed to be exposed to the step portion. The first extraction electrode is connected to a first shield film. The first shield film includes one or more thick portions having a film thickness greater than that of the other portions in the step portion.

The present disclosure is directed to an electronic component module including: a substrate; an electronic component mounted on the substrate; and a sub-module mounted on the substrate, the sub-module including a wiring board, a first electronic component disposed on one of two main surfaces of the wiring board, a second electronic component disposed on the other of the two main surfaces of the wiring board, and a first sealing member that covers the wiring board, the first electronic component, and the second electronic component.

Electronic component module, sub-module, and method for manufacturing same

A module includes: a substrate having a first face; a plurality of components mounted on the first face; a resin film that covers the plurality of components along contours of the plurality of components and also covers a part of the first face; and a shield film formed to overlap the resin film. The first face is provided with a ground electrode. The resin film has an opening, and the shield film is connected to the ground electrode via the opening.

A module includes a main substrate, a sub-module mounted on a first surface of the main substrate, a first component mounted on the first surface separately from the sub-module, and a first sealing resin formed so as to cover the first surface and the first component. The sub-module includes a second component, a second sealing resin disposed so as to cover the second component, and an inner shield film formed so as to cover at least a part of side surfaces of the second sealing resin and not to electrically connect to the main substrate. A ground connection conductor is disposed so as to electrically connect to the inner shield film, and the ground connection conductor is exposed to the outside.

High-frequency module having a compartment shield structure

A circuit module includes: a main substrate; a submodule that is mounted on a top surface of the main substrate; a main sealing resin that is provided on the top surface of the main substrate, and covers at least part of the submodule; and a conductive shield film that covers at least part of the main sealing resin. The submodule includes a sub-substrate, an electronic part that is mounted on a top surface of the sub-substrate, a plurality of conductive members that have linear shapes, and are connected to the top surface of the sub-substrate and the shield film, and a subsealing resin that is provided on the top surface of the sub-substrate, and covers the electronic part and part of each of the plurality of conductive members.

Circuit module and method for manufacturing submodule

A module () includes a substrate () having a first main surface () and including wiring, a first component () having a circuit surface (), mounted on the first main surface () such that the circuit surface () faces the first main surface (), and having a ground terminal () on the circuit surface (), a first sealing resin () disposed to cover the first main surface () and the first component (), and a heat dissipation portion () provided along an upper surface of the first sealing resin (). The wiring is connected to the ground terminal (), and the module further includes a heat conducting member () connecting the wiring and the heat dissipation portion ().

Growing community of inventors

Kyoto, Japan

Yoshihito Otsubo