Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Murata Manufcaturing Co., Ltd.

Yoshihito Otsubo

Norio Sakai

Mitsuyoshi Nishide

Shinichiro Banba

Issei Yamamoto

Tadashi Nomura

Yuta Morimoto

Yukio Yamamoto

Takanori Uejima

Motohiko Kusunoki

Takahiro Kitazume

Minoru Hatase

Nobuaki Ogawa

Yosuke Matsushita

Takafumi Kusuyama

Hideo Nakagoshi

Keisuke Araki

Ryoichi Kita

Junji Kurobe

Yoshihisa Masuda

Kyo Shin

Naoya Murakita

Tetsuya Kanagawa

Jun Sasaki

Satoshi Ishino

Keiichi Ichikawa

Jun Adachi

Takayuki Tsukizawa

Yuki Ito

Haruhiko Mori

Kenji Kubota

Bunta Okamoto

Tetsuya Oda

Syuichi Onodera

Akihiro Fujii

Tatsuyuki Yamada

Kunihiro Miyahara

Isamu Morita

Hideki Shinkai

Hirofumi Oie

Muneyoshi Yamamoto

Tatsunori Kan

Makoto Osamura

Tsuneo Murata

Takuya Murayama

Takayuki Tange

Osamu Yamaguchi

Shota Sato

Tsuyoshi Takakura

Munetake Miyashita

Takashi Osawa

Takeshi Wake

Yoshitaka Matsukawa

Hideaki Hashi

Yasuhiro Higashide

Toru Meguro

Yuji Kataoka

Daisuke Tsuruga

Masaaki Minami

Shigeru Endo

Asato Fujimoto

Takao Okano

Takayoshi Yoshikawa

Atsuko Omori

Kunio Iwakoshi

Hiroaki Tsuchida

Yoriyuki Matsumoto

Akinori Takezawa

An electronic circuit module includes: a substrate; a first electronic component mounted on one main surface of the substrate; a substrate electrode provided on the one main surface; a second electronic component supported on a support surface opposite to a surface facing the one main surface of the first electronic component; a conductor provided on the support surface of the first electronic component; a wire connected to the conductor and the substrate electrode; and a component electrode provided on a surface of the second electronic component and electrically connected to the conductor.

Electronic circuit module

A module includes a substrate having a first surface, components as one or more components mounted on the first surface, a resin film covering the one or more components along a shape of the one or more components and covering part of the first surface, a first shield film formed to overlap the resin film, and a first sealing resin as a sealing resin disposed to cover the first surface, the one or more components, and the first shield film. A stack including the resin film and the first shield film has a first opening. A first columnar conductor is disposed to be electrically connected to the first surface through the first sealing resin and the first opening. The first shield film is electrically connected to the first columnar conductor in the first opening.

Module

A module includes a substrate having a first surface and at least one recess on the first surface, and an electronic component mounted on the first surface. The electronic component is connected to the substrate via a plurality of bumps. All of the plurality of bumps are connected to the first surface inside any of the at least one recess. A height of the plurality of bumps is greater than a depth of the at least one recess. When viewed in a direction perpendicular to the first surface, a part of the electronic component is located outside an outer periphery of any recess selected from the at least one recess.

Module and method for manufacturing same

A module comprises: a substrate having a first surface; a first component that is mounted on the first surface; a first sealing resin that covers the first surface and at least a portion of the first component that is connected to the first surface; a first conductor pattern that is disposed on a surface of the first sealing resin that is farther from the first surface; and a wire that serves as a plurality of connecting conductors each electrically interconnecting the first surface and the first conductor pattern, wherein when viewed in a direction perpendicular to the first surface, the plurality of connecting conductors are disposed so as to surround the first component, and the first conductor pattern includes a frame-shaped portion that electrically interconnects the plurality of connecting conductors outside the first component successively.

A first sealing resin is disposed between a first lower main surface and a second upper main surface. An upper circuit board first mounting electrode is disposed on the first lower main surface. A lower circuit board first mounting electrode is disposed on the second upper main surface. A first component is mounted on the lower circuit board first mounting electrode and is disposed in the first sealing resin. A first conductor layer is disposed on an upper circuit board. As viewed in the downward direction, a heat conduction member overlaps the first component, is disposed in a space between the first lower main surface and the second upper main surface, and is coupled to the first conductor layer via a conductor. A part of a heat dissipation member is exposed from the first sealing resin in a direction orthogonal to an up-down axis.

Circuit module

A circuit module includes an upper circuit board, a lower circuit board, a first conductor member, a second conductor member, and a first component. The upper circuit board has a first upper main surface and a first lower main surface. The lower circuit board has a second upper main surface and a second lower main surface, is disposed below the upper circuit board, and overlaps the upper circuit board as viewed in the downward direction. The first component is mounted on the first lower main surface or the second upper main surface. The first conductor member is a metal pin and is connected to the first lower main surface. The second conductor member is a metal pin and is connected to the second upper main surface. The second conductor member is electrically connected to the first conductor member.

The module includes a substrate, a first component mounted on a first surface, a first sealing resin, and a first shield film. When viewed in a cross section taken along a plane perpendicular to the first surface, the substrate is formed with a step portion. The substrate includes a first extraction electrode disposed to be exposed to the step portion. The first extraction electrode is connected to a first shield film. The first shield film includes one or more thick portions having a film thickness greater than that of the other portions in the step portion.

The present disclosure is directed to an electronic component module including: a substrate; an electronic component mounted on the substrate; and a sub-module mounted on the substrate, the sub-module including a wiring board, a first electronic component disposed on one of two main surfaces of the wiring board, a second electronic component disposed on the other of the two main surfaces of the wiring board, and a first sealing member that covers the wiring board, the first electronic component, and the second electronic component.

Electronic component module, sub-module, and method for manufacturing same

A module includes: a substrate having a first face; a plurality of components mounted on the first face; a resin film that covers the plurality of components along contours of the plurality of components and also covers a part of the first face; and a shield film formed to overlap the resin film. The first face is provided with a ground electrode. The resin film has an opening, and the shield film is connected to the ground electrode via the opening.

A module includes a main substrate, a sub-module mounted on a first surface of the main substrate, a first component mounted on the first surface separately from the sub-module, and a first sealing resin formed so as to cover the first surface and the first component. The sub-module includes a second component, a second sealing resin disposed so as to cover the second component, and an inner shield film formed so as to cover at least a part of side surfaces of the second sealing resin and not to electrically connect to the main substrate. A ground connection conductor is disposed so as to electrically connect to the inner shield film, and the ground connection conductor is exposed to the outside.

High-frequency module having a compartment shield structure

A circuit module includes: a main substrate; a submodule that is mounted on a top surface of the main substrate; a main sealing resin that is provided on the top surface of the main substrate, and covers at least part of the submodule; and a conductive shield film that covers at least part of the main sealing resin. The submodule includes a sub-substrate, an electronic part that is mounted on a top surface of the sub-substrate, a plurality of conductive members that have linear shapes, and are connected to the top surface of the sub-substrate and the shield film, and a subsealing resin that is provided on the top surface of the sub-substrate, and covers the electronic part and part of each of the plurality of conductive members.

Circuit module and method for manufacturing submodule

A module () includes a substrate () having a first main surface () and including wiring, a first component () having a circuit surface (), mounted on the first main surface () such that the circuit surface () faces the first main surface (), and having a ground terminal () on the circuit surface (), a first sealing resin () disposed to cover the first main surface () and the first component (), and a heat dissipation portion () provided along an upper surface of the first sealing resin (). The wiring is connected to the ground terminal (), and the module further includes a heat conducting member () connecting the wiring and the heat dissipation portion ().

A module includes a substrate including a first main surface, a first component mounted on the first main surface, a first sealing resin that covers the first main surface and a portion of connection of the first component to at least the first main surface, a first conductor pattern arranged on a surface of the first sealing resin on a side distant from the first main surface, and a columnar conductor as a metal member connected to the first conductor pattern to pass through the first sealing resin from an electrode drawn from the first component along the first main surface.

A module includes: a board having a first main surface; a first component mounted on the first main surface; a first conductor column group including a plurality of conductor columns arranged on the first main surface along at least a part of an outer periphery of the first component; a first ground conductor disposed inside the board; a first conductor via group including a plurality of via conductors that connect the first ground conductor and an end of each of the conductor columns, the end of each of the conductor columns being located close to the first main surface; and a shield film disposed to cover over the first component. When viewed in a cross section taken along a plane perpendicular to the first main surface, the first component is at least partially surrounded by the first conductor column group, the first conductor via group, and the first ground conductor.

A modules is provided in which an electronic component is disposed on a first main surface and each of a plurality of first connection terminals is disposed on a second main surface. Moreover, a second connection terminal is disposed on the second main surface. When a substrate is viewed in a direction perpendicular to the second main surface, the second connection terminal is larger in area than each of the first connection terminals. When the substrate is viewed in the direction perpendicular to the second main surface, the second connection terminal is disposed on a straight line connecting the first connection terminals. The second connection terminal serves to establish an electrical connection.

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Kyoto, Japan

Yoshihito Otsubo