Adv Antest Corporation

Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Takeda Riken Co., Ltd.

Kioxia Corporation

Mitsubishi Heavy Industries Limited

Yoshihito Kobayashi

Akihiko Ito

Hiroto Nakamura

Yasunobu Onishi

Hirokazu Niki

Rumiko Hayase

Tsuyoshi Yamashita

Yoshiyuki Masuo

Shin Nemoto

Hiroshi Sato

Hiroki Ikeda

Katsuhiko Suzuki

Takeshi Onishi

Naohiko Oyasato

Kazuyuki Yamashita

Makoto Sagawa

Masamitsu Ito

Hiroo Nakamura

Jun Watanabe

Masamitsu Itoh

Kenji Uchida

Toru Ushirogouchi

Kenichi Shimada

Kazuo Sato

Shuzi Hayase

Yasuhiro Wada

Toshiyuki Kiyokawa

Noriyuki Igarashi

Masataka Miyamura

Takashi Kamo

Akitoshi Kumagae

Yukihiro Iwasa

Hiroyuki Hosoya

Yuichiro Hirano

Keiichi Shiraishi

Fumito Hiratani

Taro Inada

Akihiko Itoh

Noahiko Oyasato

Shuzi Nayase

According to one embodiment, a chuck cleaner includes a support, an adhesive layer, and a support substrate. The support includes a first portion, a second portion, and a third portion provided between the first portion and the second portion. The support substrate is provided between the support and the adhesive layer. The support substrate includes a first region fixed to the first portion, a second region fixed to the second portion, a third region provided between the first region and the second region and having variable distance from the third portion, a fourth region provided between the first region and the third region and separated from the support, and a fifth region provided between the second region and the third region and separated from the support.

Chuck cleaner and cleaning method

There is provided a reticle chuck cleaner A for cleaning a reticle chuck of an apparatus, as a reticle chuck cleaner that allows easy cleaning of a reticle chuck in a vacuum chamber of an apparatus without exposing the chamber to the atmosphere and contributes to improvement of the operating ratio of the apparatus, including: an adhesive layerto be adhered to a chuck region of the reticle chuck; a support layerlaminated on the adhesive layer; and a substratehaving a shape capable of being carried to the reticle chuck, the support layerand the substratebeing partially bonded together in an adhesive regionof a partial adhesive layer

Reticle chuck cleaner and reticle chuck cleaning method

According to one embodiment, an electrostatic chuck cleaner cleaning an adsorption face of an electrostatic chuck capable of attracting a reticle, and the cleaner includes: a plurality of substrates; adhesive layers provided on a major surface of each of the substrates, the adhesive layers being pressed against the adsorption face; and conductive layers provided on the major surface of each of the substrates, and the conductive layers being provided in a region other than a region where the adhesive layer being provided. The adhesive layers provided on the major surface of each of the substrates are disposed in different regions, and the entire adsorption face is pressed by the adhesive layers when the adhesive layers of the substrates are pressed against the adsorption face.

Electrostatic chuck cleaner, cleaning method, and exposure apparatus

According to one embodiment, a mask cleaner includes a cleaner support casing having a major surface with a recess formed therein, another major surface, and a gas supply hole and a gas exhaust hole extending through the cleaner support casing between the another major surface and the recess, a sticky layer support board attached to the cleaner support casing to block an opening of the recess of the cleaner support casing, and a sticky layer attached to a surface of the sticky layer support board remote from the cleaner support casing.

Mask cleaner and cleaning method

According to one embodiment, a method for manufacturing a template for imprinting includes preparing a first template having a device pattern and a plurality of identification patterns, and forming a second template by transferring the device pattern and at lest desired one of the identification patterns to a template substrate.

Method for manufacturing template and method for manufacturing semiconductor device

In one embodiment, a patterning method is disclosed. The method includes applying an uncured imprint material containing a first curing agent and a second curing agent onto a substrate. The method includes pressing a template against the imprint material. The method includes reacting the first curing agent with the template pressed against the imprint material. The method includes stripping the template from the imprint material. In addition, the method includes reacting the second curing agent.

Patterning method and method for manufacturing semiconductor device

An electronic device test apparatus includes a plurality of testers on which are mounted test heads that are connected to test outputters for outputting test signals to the electronic devices and for receiving response signals from the electronic devices. A loading transporter is provided at a frontmost stage of the testers that transports the electronic devices from a previous process conveyance medium to a test tray before loading the electronic devices into the testers. An unloading transporter is provided at a rearmost stage of the testers that unloads the electronic devices from the test tray to a later process conveyance medium corresponding to the response signals. A transporter is provided between the testers that transports the test tray from a previous process tester to a later process tester. The transporter includes a buffer that holds test trays to absorb a waiting time due to differences in processing capacities between test trays.

Electronic device test apparatus for successively testing electronic devices

An apparatus having a plurality of test units (), a loading transport unit () transporting a plurality of electronic devices from a customer tray (C) to a test tray (T) before being loaded in a test unit, and a classifying transport unit () transporting a plurality of electronic devices from a test tray while classifying them to customer trays in accordance with test results, the loading transport unit being provided at least at a frontmost stage of a plurality of test units, the classifying transport unit being provided at least at a rearmost stage of the plurality of test units, the test tray being successively conveyed from the frontmost stage to the rearmost stage of the plurality of test units in the state carrying electronic devices and returned from the rearmost stage test unit to the frontmost stage test unit.

An IC tester which is capable of reducing the time required before completion of testing on all of ICs to be tested is provided. The depth (length in the Y-axis direction) of the constant temperature chamberand the exit chamberis expanded by a dimension corresponding approximately to one transverse width (length of the minor edge) of the rectangular test tray, and two generally parallel test tray transport paths or alternatively a widened test tray transport path broad enough to transport two test trays simultaneously with the two test trays juxtaposed in a direction transverse to the widened test tray transport path are provided in the section of test tray transport path extending from the soak chamberin the constant temperature chamberthrough the testing sectionin the constant temperature chamberto the exit chamberso that two test trays may be simultaneously transported along the two test tray transport paths or the widened test tray transport path.

Semiconductor device testing apparatus and a test tray for use in the testing apparatus

A method of judging whether an electronic component is good or defective in accordance with a response output signal by inputting a test signal to the IC to be tested, wherein a common test signal is input to respective electronic devices A and A of a group of electronic devices composed of a plurality of electronic devices, and in accordance with a response signal thereof, the group of electronic devices as a whole subjected to the test is judged to be good or defective. In the second test, each of the DUTs A and A of the group of electronic devices judged to be defective is input a mutually independent test signal, and in accordance with the response signal thereof, it is judged whether each of the electronic devices A and A subjected to the test is good or defective.

Method of testing electronic components and testing apparatus for electronic components

An IC tester which is capable of reducing the time required before completion of testing on all of ICs to be tested is provided. The depth (length in the Y-axis direction) of the constant temperature chamber and the exit chamber is expanded by a dimension corresponding approximately to one transverse width (length of the minor edge) of the rectangular test tray and two generally parallel test tray transport paths or alternatively a widened test tray transport path broad enough to transport two test trays simultaneously with the two test trays juxtaposed in a direction transverse to the widened test tray transport path are provided in the section of test tray transport path extending from the soak chamber in the constant temperature chamber through the testing section in the constant temperature chamber to the exit chamber so that two test trays may be simultaneously transported along the two test tray transport paths or the widened test tray transport path.

Tester for semiconductor devices and test tray used for the same

An electric device testing apparatus comprises a connection terminal to which an IC chip to be tested is removably connected, a pusher for pushing the IC chip in the direction of the connection terminal in order to connect the IC chip to the connection terminal, and temperature adjusted air supply for blowing a temperature adjusted air to around the IC chip during a test on the IC chip via a through hole formed on the pushed.

Electric device testing apparatus

An electric device testing apparatus for carrying out a test by pushing a terminal of an IC against a contact portion of a test head, comprising a temperature calculation means for calculating an actual temperature of the IC based on a signal from a temperature sensing element provided on the IC.

Electric device testing apparatus and electric device testing method

A semiconductor device testing system is provided which can efficiently utilize a plurality of semiconductor device testing apparatus. There are provided a host computer for controlling a plurality of semiconductor device testing apparatus A, B, and C, and a dedicated classifying machine Storage information memory means for storing storage information of each semiconductor device such as a number assigned to each tested semiconductor device, the test results of each semiconductor device, and the like is provided in the host computer Without sorting the tested devices or with the sorting operation of the tested devices into only two categories in the handler part of each testing apparatus, the tested devices are transferred from the test tray to a general-purpose tray, and during this transfer operation, the storage information of each device is stored in the storage information memory means. When all the tests are completed, the storage information of each device stored in the storage information memory means is transmitted to the dedicated classifying machine by which the tested devices are sorted out.

Semiconductor device testing apparatus and semiconductor device testing system having a plurality of semiconductor device testing apparatus

Growing community of inventors

Tokyo, Japan

Yoshihito Kobayashi