Sony Corporation

Sanyo Electric Co., Ltd.

Yoshihito Higashitsutsumi

Yoshiteru Kamatani

Masami Suzuki

Toshihiro Furusawa

Jun Iwama

Shuji Shimizu

Naoki Nishi

Junichi Muramoto

Yukihisa Kinugasa

Yoichiro Fujinaga

Akinori Kadota

Akihiro Yanai

Kenji Toyonaga

Toshiaki Iwafuchi

Shinichiro Gomi

Hiroyuki Yamagishi

Takehisa Ishida

Nobuyuki Nagai

Hideo Kawabe

Yusaku Kato

Tomomichi Nakai

Satoshi Shimizu

Minoru Hamada

Masayoshi Morita

Yoshimitsu Noguchi

Toru Akiyama

Kazuo Ishimoto

Hiroya Ito

Kazuo Naganawa

Isaya Kitamura

Yuzo Otsuru

Yukihiro Yamada

An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

Image pickup apparatus and camera module

An imaging device includes a camera, a light source, a polarizerarranged between the cameraplus the light sourceand an object, and a spatial light modulatorA arranged between the polarizerand the objectto control a revolution angle of an emitting light polarization plane relative to an incident light polarization plane.

Imaging device and imaging method

There is provided an imaging unit comprising at least one image sensor, a measuring instrument including at least one marker, a position computing unit, a determining unit, and an output controller, wherein the imaging unit is configured to acquire an image comprising a user and the marker, and provide the acquired image to the position computing unit, wherein the position computing unit is configured to compute a position of the marker with respect to the user based on the image provided by the imaging unit, and further provide the computed position to the determining unit, wherein the determining unit is configured to determine whether the computed position of the marker matches a retrieved measurement position, and further output the result of the determination to the output controller, and wherein the output controller is configured to provide an indication when the marker position matches the measurement position.

Information processing apparatus, information processing method, program, and measuring system

A chip size package (CSP) includes an antenna for wireless communication, used in signal transmission and reception with external substrates, the antenna being formed as a wiring of a rewiring layer, the rewiring layer being disposed between a silicon layer and solder bumps.

Chip size package (CSP)

There is provided a camera module including: a lens; an image pickup device arranged on an optical axis of the lens; and an actuator section configured to reciprocate the image pickup device in an optical axis direction of the lens, wherein the actuator section includes a movable joint section on which the image pickup device is fixed, a parallel link mechanism section having a movable end section attached to the movable joint section and a mounting end section, and a movable element that is configured to perform displacement motion by a displacement amount depending on a level of a voltage to be applied and that is coupled to a coupling region between the movable joint section and the movable end section of the parallel link mechanism section in such a manner that the displacement motion is transmittable.

Camera module and camera apparatus and parallel link mechanism for reciprocating an image pickup device

An optical sensor is described herein. By way of example, the optical sensor comprises a first light filter on a first light-receiving surface of an image sensor, and a second light filter on a second light-receiving surface of the image sensor. The second light-receiving surface is on an opposite side of the image sensor from the first light-receiving surface. The characteristics of the first light filter are different than characteristics of the second light filter.

Double-sided optical sensor for a camera module

The present invention relates to an image signal processing circuit, an image capture device, and image signal processing method, and a program capable of reading special information, such as a bar code, using normal lenses with high precision without needing dedicated EDOF lenses and signal processing circuits. The image signal processing circuit has a processing circuitwhich performs image processing using one color signal (B) having resolution on a near point side from among a plurality of color signals, and an enhancement processing unitwhich performs enhancement processing by applying an inverse function of a point spread function (PSF) to a signal subjected to the image processing using the one color signal by the processing circuit.

Image signal processing circuit, image capture device, image signal processing method, and program

A lens module includes a lens body; a lens holding member that movably holds the lens body along an optical axis of the lens body without tilting the optical axis; a displacement element that has a flat-plate shape of which one end edge on a side of the lens body along the optical axis is disposed as a free end and the free end is displaced to freely approach the lens body by applying a voltage; and a push-up member that is disposed on the free end of the displacement element and is inserted on one end surface side of the lens body, which is perpendicular to the optical axis, by the approach towards the lens body of the displacement element so as to push up the lens body in the optical axis direction.

Lens module, image capturing device, and electronic apparatus

An image pickup unit and an image processing unit are provided, each inexpensively achieving both of far distance photographing and near distance photographing in a simple configuration. In an image processing section, a correction coefficient selection sectionselects one of a correction coefficient kfor a distant object and a correction coefficient kfor a proximate object in response to a mode setting signal input by a user, and outputs the selected correction coefficient to a deblurring processing section. The deblurring processing sectionperforms blur correction to image data Dbased on imaging data Dwith use of the selected correction coefficient. This allows appropriate blur correction to the imaging data of each of the distant object and the proximate object.

Image pickup unit and image processing unit for image blur correction

A camera module includes an imaging sensor, a power feed electrode, a first conductive member, and a first sealing member. The imaging sensor includes a light-receiving surface receiving light gathered by a lens. The power feed electrode is formed to a surface including the light receiving-surface of the imaging sensor, and the power feed electrode is configured to make a power feed. The first conductive member is configured to electrically connect the power feed electrode and a drive electrode. The drive electrode is provided to a drive section configured to drive the lens in accordance with the power feed. The first sealing member is formed by sealing the first conductive member.

Camera module, and manufacturing device and method for the same

A compact and thin lens module that uses a flat-plate-shaped displacement device to drive a lens, and a compact, thin imaging apparatus and electronic system using the lens module.

Lens module, imaging apparatus, electronic system, and method for driving lens module

Growing community of inventors

Kanagawa, Japan

Yoshihito Higashitsutsumi