Kabushiki Kaisha Toshiba

Yoshihito Fukasawa

Toshihiro Kato

Masamichi Shindo

Hisaaki Maiwa

A test handler for a semiconductor device has a test socket for holding a semiconductor device sealed in a package, a temperature sensor for detecting the surface temperature of the package, a temperature controller for performing temperature control of the semiconductor device to set the temperature of the package detected by the temperature sensor at a predetermined temperature, and an electric characteristics measurer for applying a predetermined potential to the semiconductor device to measure electric characteristics.

Test handler for semiconductor device

In a test handler for semiconductor devices according to the invention, test trays are provided with respective identification codes specific to them and the identification codes of the test trays are read by a reading device arranged respectively at given control sites in the test handler and stored in a control table and controlled by a control device along with data on the control sites for reading the identification codes of test trays and the product ICs loaded on the test trays carrying the detected identification codes. Additionally, the contents of the control table are displayed on a monitor screen and the data on the individual test trays obtained at the individual control sites and those on the product ICs are centrally controlled.

Test handler for semiconductor devices

There is provided a method including a plurality of processes for processing intermediary products stepwise by a plurality of processing units arranged at respective processes, thus to manufactur products while carrying intermediary products or carriers for accommodating them therein. This method comprises the steps of reading discrimination codes attached to the intermediary products or carriers prior to the first process, and recording the discrimination codes thus read as basic information and recording processing information in regard to the processings by the processing units at the respective processes in correspondence with the basic information. This method further comprises the step of selecting one processing unit from a plurality of processing units at the process of the next state on the basis of the processing information recorded. There is also provided an apparatus for implementing the above method, which includes supervisory control means for carrying out selective control of processing units. Thus, a manufacturing method and an apparatus therefor capable of implementing efficient manufacturing processing can be realized.

Method and apparatus for sequential product processing with limited

An apparatus and a method for inspecting semiconductor devices, where a focused laser beam scans the semiconductor device, and the reflected beam thereof indicating height information of the reflection positions on the semiconductor device is detected for producing detected signals. The detected signals are compared with predetermined acceptance levels of height and distance.

Growing community of inventors

Yokohama, Japan

Yoshihito Fukasawa