Asahi Kasei Construction Materials Corporation

Nec Corporation

Asahi Kasei Chemicals Corporation

Solidia Technologies, Inc.

Asahi Kasei Contruction Materials Corporation

Yoshihito Fukasawa

Hisashi Mihori

Vahit Atakan

Takahiro Kimura

Sadananda Sahu

Michinobu Tanioka

Hirobumi Inoue

Omkar Deo

David Vuong

Tohru Okuda

Shoichiro Harada

Shigemi Mukaiyama

Masato Hamajima

Hiroo Ito

Yoshimitsu Inoue

Takatoshi Kitagawa

Katsuhiko Kanno

Ken Ihara

Hirotaka Takase

Yukihiro Shimizu

Takayuki Kamata

Yuuki Saito

An aerated composite material produced from carbonatable calcium silicate compositions (carbonation cured AAC) that has a compressive strength equivalent to autoclaved aerated concrete (ordinary AAC) at substantially the same density and a process of production of the same are provided. The composite material of the present invention comprises: a plurality of bonding elements, each including a core comprising calcium silicate, a first layer which partially or fully surrounds the core and is rich in SiO, and a second layer which partially or fully surrounds the first layer and is rich in CaCO; a plurality of filler particles having their particle sizes ranging from 0.1 &#x3bc;m to 1000 &#x3bc;m; and a plurality of voids; wherein the plurality of bonding elements and plurality of filler particles together form a bonding matrix and are substantially evenly dispersed in the matrix and bonded together, the plurality of voids are bubble-shaped and/or interconnected channels, a pore volume with a radius of 0.004 &#x3bc;m to 10.0 &#x3bc;m in the plurality of voids is 0.30 ml/composite material 1 g or less, and a estimated compressive strength expressed by the following formula (1): estimated compressive strength (absolute dry density=0.50)=compressive strength&#xd7;(0.50+absolute dry density)is 2.0 N/mmor greater.

Lightweight composite materials produced from carbonatable calcium silicate and methods thereof

A phenol resin foamed plate contains hydrocarbon and/or chlorinated aliphatic hydrocarbon, in which an average cell diameter is in a range of 5 &#x3bc;m or more and 200 &#x3bc;m or less, a void area ratio is 5% or less in its cross section, a density is 15 kg/mor more and 26 kg/mor less, and when compression is made by a 10% displacement in a direction perpendicular to the thickness direction, a recovery rate 1 minute after release of this compression is 96.0% or more and 98.5% or less and a degree of change in recovery rates C is 0.030%/hr or more and 0.060%/hr or less.

Phenol resin foamed plate

A phenolic resin foam laminated sheet comprising a phenolic resin foam; and a face material for covering a surface of the phenolic resin foam, wherein the phenolic resin foam contains a hydrocarbon, a chlorinated aliphatic hydrocarbon or a combination thereof, a density of the phenolic resin foam is 10 kg/mor higher and 100 kg/mor lower, an average cell diameter of the phenolic resin foam is 5 &#x3bc;m or larger and 200 &#x3bc;m or smaller, a closed cell content of the phenolic resin foam is 85% or higher and 99% or lower, and an absolute value of a dimensional charge rate of the phenolic resin foam after 70&#xb0; C. for 48 hours is 0.49% or lower.

Phenolic resin foam laminated sheet and method for manufacturing the same

There is provided an expandable phenolic resin composition comprising: a phenolic resin; an acid curing catalyst for the resin; a foaming agent; and a surfactant, wherein the foaming agent comprises a hydrocarbon-based foaming agent; and the surfactant is a polyoxyethylene alkyl ether having an alkyl ether moiety having 14 to 22 carbon atoms, and the content of the surfactant is 0.01 to 10 parts by weight relative to 100 parts by weight of the phenolic resin.

Expandable phenolic resin composition, phenolic resin foam, and method for producing the phenolic resin foam

The present invention provides a foam comprising (a) a polylactic acid resin, (b) at least one thermoplastic resin selected from a polyolefin resin and a polystyrene resin, and (c) a block copolymer of a vinyl aromatic compound and a conjugated diene, wherein a ratio of (a) to (b) by weight (a/b) is 80/20 to 20/80, and the foam comprises 0.5 to 20 parts by weight of (c) with respect to 100 parts by weight of (a) and (b) in total.

Foam

In a bare-chip LSI mounting board test apparatus, at the stage that a bare-chip LSI is mounted on a board, tester boards on which equivalent parts corresponding to SMT parts other than the bare-chip LSI to be mounted on the board is confronted to the board, probes connected to the respective equivalent parts of the tester boards which correspond to the mount parts are brought into contact with pads located at the mount places of the mount parts on the board on which the bare-chip LSI is mounted to built a quasi-mount state of the mount parts to the board, and under this state a test signal is transmitted from a controller to the bare-chip LSI.

Apparatus for testing a bare-chip LSI mounting on a printed board

There is provided a semiconductor device tester including (a) a tester substrate having the same structure as a structure of a substrate as a product except that a semiconductor device is not mounted on the tester substrate, (b) an electrically conductive sheet covering therewith a first area in which the semiconductor device is to be mounted on the tester substrate, the electrically conductive sheet being electrically insulating in a certain direction, and (c) a holder supporting a semiconductor device to be tested therewith, and compressing the semiconductor device onto the electrically conductive sheet to thereby electrically connect an externally projecting terminal of the semiconductor device to a connection terminal mounted on the tester substrate in the first area.

Semiconductor device tester and method of testing semiconductor device

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Tokyo, Japan

Yoshihito Fukasawa