Sumitomo Bakelite Company Limited

Sumitomo Baeklite Company Limited

Yoshihito Akiyama

Hiroshi Hirose

Hirotaka Nonaka

Akiko Okubo

Yoshiyuki Goh

Maki Sugawara

Sumiya Miyake

Yoshiyuki Go

Hiromi Oki

Naoki Tomida

An epoxy resin composition which comprises an epoxy resin (A), a curing agent (B), a curing accelerator (C) and a component retarding curing of the epoxy resin (D) which is at least one component selected from components (a), (b) and (c) represented by general formulae [1], [2] and [3], respectively, a semiconductor device having a semiconductor element encapsulated by using the composition, and a process for providing latency to an epoxy resin composition. The epoxy resin exhibits excellent storage stability, excellent fluidity and curing property during encapsulating by molding and excellent resistance to soldering without forming cleavages or cracks by the soldering treatment at high temperatures in accordance with the lead-free soldering. An epoxy resin composition can be provided with latency by adjusting the amounts of the curing accelerator and the component for retarding curing.   

Epoxy resin composition, process for providing latency to the composition and a semiconductor device

A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).

Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt

Curing accelerator, epoxy resin composition, and semiconductor device

The present invention provides an epoxy resin composition that has both a rapidly-curability and an excellent storage stability and is useful in the field of electronic and electric materials. That is, the present invention is an epoxy resin composition comprising a compound (A) having two or more epoxy groups in the molecule, a co-condensation product (B) having two or more phenolic hydroxyl groups in the molecule, and a molecular association product (C) of a tetra-substituted phosphonium (X), a compound (Y) having two or more phenolic hydroxyl groups in the molecule, and a conjugate base of the compound (Y) having two or more phenolic hydroxyl groups in the molecule, said conjugate base being a phenoxide type compound obtained by removing a hydrogen atom from the aforesaid compound (Y) having two or more phenolic hydroxyl groups in the molecule.

Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product

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Kanagawa, Japan

Yoshihito Akiyama